Roll-to-roll paper sensors (ROPAS); Wireless communicating sensors on paper in the logistic chain

C. Rentrop, E. Rubingh, R. Lelieveld, H. Sandberg

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    The ROPAS project (Roll-to-roll paper sensors) combines high end electronics and wireless sensors with low cost paper substrates and processing techniques that can be applied on a large scale. Paper is the next step in the printed electronics roadmap of utilising cheaper substrate materials as a replacement of silicon and PET and is generally referred to as paper electronics. The creation of highly conductive structures applied at high speed on (temperature unstable) paper is extremely important to enable paper electronics. Hereto, recent advantages in nanotechnology such as (encapsulation) printing, surface modification of fiber based products, sensor and battery development, and electronic design (wireless communication) are integrated for large scale roll to roll and sheet to sheet paper applications. The possibilities of paper electronics are demonstrated in high impact (security) and logistics applications, which are demonstrated in security tags and smart labels for anti-counterfeiting purposes by e.g. integration of near field communication (NFC) in paper and finally track-and-trace post pieces such as envelopes. The paper explains the project and its impact, including implications of using a rough, coarse, porous and composite, paper substrate of limited high temperature stability on the design and fabrication of demonstrators and building blocks. Important topics herein are: fast curing of conductive inks on paper using state of the art printing techniques such as inkjet, screen and flexogravure. In the talk, synthesis of printable (humidity) sensor materials, placing of electrical components on paper surfaces including electronic design of the wireless communication and environmental and recycling constraints of the products are discussed as well.
    Original languageEnglish
    Title of host publicationProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Electronic)978-1-4799-4026-4
    DOIs
    Publication statusPublished - 2014
    MoE publication typeA4 Article in a conference publication

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