Abstract
| Original language | English |
|---|---|
| Title of host publication | 2015 ICFPE |
| Subtitle of host publication | Program Book |
| Publication status | Published - 2015 |
| MoE publication type | B3 Non-refereed article in conference proceedings |
| Event | 6th International Conference on Flexible and Printed Electronics, ICFPE 2015 - Taipei, Taiwan, Province of China Duration: 21 Oct 2015 → 23 Oct 2015 Conference number: 6 |
Conference
| Conference | 6th International Conference on Flexible and Printed Electronics, ICFPE 2015 |
|---|---|
| Abbreviated title | ICFPE 2015 |
| Country | Taiwan, Province of China |
| City | Taipei |
| Period | 21/10/15 → 23/10/15 |
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Keywords
- printed electronics
- hybrid electronics
- roll-to-roll manufacturing
Cite this
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Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT. / Kemppainen, Antti; Rönkä, Kari.
2015 ICFPE: Program Book. 2015.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific
TY - GEN
T1 - Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT
AU - Kemppainen, Antti
AU - Rönkä, Kari
N1 - SDA: SHP: Pro-Io-T
PY - 2015
Y1 - 2015
N2 - Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.
AB - Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.
KW - printed electronics
KW - hybrid electronics
KW - roll-to-roll manufacturing
UR - http://expo.itri.org.tw/WebSiteFiles/Download/2015ICFPE/38/2015%20ICFPE%20Program%20Book-final.pdf
M3 - Conference article in proceedings
BT - 2015 ICFPE
ER -