Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT

Antti Kemppainen; Kari Rönkä

Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.

Original language	English
Title of host publication	2015 ICFPE
Subtitle of host publication	Program Book
Publication status	Published - 2015
MoE publication type	B3 Non-refereed article in conference proceedings
Event	6th International Conference on Flexible and Printed Electronics, ICFPE 2015 - Taipei, Taiwan, Province of China Duration: 21 Oct 2015 → 23 Oct 2015 Conference number: 6

Conference

Conference	6th International Conference on Flexible and Printed Electronics, ICFPE 2015
Abbreviated title	ICFPE 2015
Country	Taiwan, Province of China
City	Taipei
Period	21/10/15 → 23/10/15

Keywords

printed electronics
hybrid electronics
roll-to-roll manufacturing

Access to Document

Program Book

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Cite this

@inproceedings{af4b2bfb0afc4cb2b6dfedb55d535a8f,

title = "Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT",

abstract = "Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.",

keywords = "printed electronics, hybrid electronics, roll-to-roll manufacturing",

author = "Antti Kemppainen and Kari R{\"o}nk{\"a}",

note = "SDA: SHP: Pro-Io-T ; 6th International Conference on Flexible and Printed Electronics, ICFPE 2015, ICFPE 2015 ; Conference date: 21-10-2015 Through 23-10-2015",

year = "2015",

language = "English",

booktitle = "2015 ICFPE",

}

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T1 - Roll-to-roll printed and flexible electronics for wearable, healthcare and IoT

AU - Kemppainen, Antti

AU - Rönkä, Kari

N1 - Conference code: 6

PY - 2015

Y1 - 2015

N2 - Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.

AB - Printed electronics enable roll to roll manufacturing of flexible components and devices in high throughput process. However, printing of fully integrated systems is not typically today possible without additional hybrid assembly of conventional electronics components. In latest developments hybrid assembly can be fully roll to roll process utilizing tiny bare die components, enabling paper thin and flexible electronics production in high volumes. This form is ideal for integration of electronics to smart surfaces onto plastics, construction materials, wearable devices or skin contact patches. Even though the throughput of hybrid production is not as high as the printing, the process can be highly automatized.

KW - printed electronics

KW - hybrid electronics

KW - roll-to-roll manufacturing

UR - http://expo.itri.org.tw/WebSiteFiles/Download/2015ICFPE/38/2015%20ICFPE%20Program%20Book-final.pdf

M3 - Conference article in proceedings

BT - 2015 ICFPE

T2 - 6th International Conference on Flexible and Printed Electronics, ICFPE 2015

Y2 - 21 October 2015 through 23 October 2015

ER -