Scalable electro-photonic integration concept based on polymer waveguides

E. Bosman, G. Van Steenberge, A. Boersma, S. Wiegersma, P. Harmsma, M. Karppinen, T. Korhonen, B. J. Offrein, R. Dangel, A. Daly, M. Ortsiefer, J. Justice, B. Corbett, S. Dorrestein, J. Duis

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

    Original languageEnglish
    Title of host publicationOptical Interconnects XVI
    PublisherInternational Society for Optics and Photonics SPIE
    Volume9753
    ISBN (Electronic)9781628419887
    DOIs
    Publication statusPublished - 1 Jan 2016
    MoE publication typeA4 Article in a conference publication
    EventOptical Interconnects XVI - San Francisco, United States
    Duration: 15 Feb 201617 Feb 2016

    Conference

    ConferenceOptical Interconnects XVI
    CountryUnited States
    CitySan Francisco
    Period15/02/1617/02/16

    Fingerprint

    Polymer Waveguide
    Photonics
    Waveguide
    Polymers
    Waveguides
    photonics
    waveguides
    polymers
    Fabrication
    Vertical-cavity Surface-emitting Laser (VCSEL)
    Substrate
    Single Mode
    optical coupling
    assembly
    Surface emitting lasers
    glass fibers
    Glass fibers
    fabrication
    Fiber
    Substrates

    Keywords

    • Fiber-coupling
    • Micromirror
    • Nano-imprinting
    • Photonic integration
    • Polymer waveguides

    Cite this

    Bosman, E., Van Steenberge, G., Boersma, A., Wiegersma, S., Harmsma, P., Karppinen, M., ... Duis, J. (2016). Scalable electro-photonic integration concept based on polymer waveguides. In Optical Interconnects XVI (Vol. 9753). [97530G] International Society for Optics and Photonics SPIE. https://doi.org/10.1117/12.2225304
    Bosman, E. ; Van Steenberge, G. ; Boersma, A. ; Wiegersma, S. ; Harmsma, P. ; Karppinen, M. ; Korhonen, T. ; Offrein, B. J. ; Dangel, R. ; Daly, A. ; Ortsiefer, M. ; Justice, J. ; Corbett, B. ; Dorrestein, S. ; Duis, J. / Scalable electro-photonic integration concept based on polymer waveguides. Optical Interconnects XVI. Vol. 9753 International Society for Optics and Photonics SPIE, 2016.
    @inproceedings{7f58983e6e954f4f90a10a943bf6c6b3,
    title = "Scalable electro-photonic integration concept based on polymer waveguides",
    abstract = "A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project {"}Firefly{"} and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.",
    keywords = "Fiber-coupling, Micromirror, Nano-imprinting, Photonic integration, Polymer waveguides",
    author = "E. Bosman and {Van Steenberge}, G. and A. Boersma and S. Wiegersma and P. Harmsma and M. Karppinen and T. Korhonen and Offrein, {B. J.} and R. Dangel and A. Daly and M. Ortsiefer and J. Justice and B. Corbett and S. Dorrestein and J. Duis",
    year = "2016",
    month = "1",
    day = "1",
    doi = "10.1117/12.2225304",
    language = "English",
    volume = "9753",
    booktitle = "Optical Interconnects XVI",
    publisher = "International Society for Optics and Photonics SPIE",
    address = "United States",

    }

    Bosman, E, Van Steenberge, G, Boersma, A, Wiegersma, S, Harmsma, P, Karppinen, M, Korhonen, T, Offrein, BJ, Dangel, R, Daly, A, Ortsiefer, M, Justice, J, Corbett, B, Dorrestein, S & Duis, J 2016, Scalable electro-photonic integration concept based on polymer waveguides. in Optical Interconnects XVI. vol. 9753, 97530G, International Society for Optics and Photonics SPIE, Optical Interconnects XVI, San Francisco, United States, 15/02/16. https://doi.org/10.1117/12.2225304

    Scalable electro-photonic integration concept based on polymer waveguides. / Bosman, E.; Van Steenberge, G.; Boersma, A.; Wiegersma, S.; Harmsma, P.; Karppinen, M.; Korhonen, T.; Offrein, B. J.; Dangel, R.; Daly, A.; Ortsiefer, M.; Justice, J.; Corbett, B.; Dorrestein, S.; Duis, J.

    Optical Interconnects XVI. Vol. 9753 International Society for Optics and Photonics SPIE, 2016. 97530G.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

    T1 - Scalable electro-photonic integration concept based on polymer waveguides

    AU - Bosman, E.

    AU - Van Steenberge, G.

    AU - Boersma, A.

    AU - Wiegersma, S.

    AU - Harmsma, P.

    AU - Karppinen, M.

    AU - Korhonen, T.

    AU - Offrein, B. J.

    AU - Dangel, R.

    AU - Daly, A.

    AU - Ortsiefer, M.

    AU - Justice, J.

    AU - Corbett, B.

    AU - Dorrestein, S.

    AU - Duis, J.

    PY - 2016/1/1

    Y1 - 2016/1/1

    N2 - A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

    AB - A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

    KW - Fiber-coupling

    KW - Micromirror

    KW - Nano-imprinting

    KW - Photonic integration

    KW - Polymer waveguides

    UR - http://www.scopus.com/inward/record.url?scp=84975159111&partnerID=8YFLogxK

    U2 - 10.1117/12.2225304

    DO - 10.1117/12.2225304

    M3 - Conference article in proceedings

    AN - SCOPUS:84975159111

    VL - 9753

    BT - Optical Interconnects XVI

    PB - International Society for Optics and Photonics SPIE

    ER -

    Bosman E, Van Steenberge G, Boersma A, Wiegersma S, Harmsma P, Karppinen M et al. Scalable electro-photonic integration concept based on polymer waveguides. In Optical Interconnects XVI. Vol. 9753. International Society for Optics and Photonics SPIE. 2016. 97530G https://doi.org/10.1117/12.2225304