Scalable electro-photonic integration concept based on polymer waveguides

E. Bosman, G. Van Steenberge, A. Boersma, S. Wiegersma, P. Harmsma, M. Karppinen, T. Korhonen, B. J. Offrein, R. Dangel, A. Daly, M. Ortsiefer, J. Justice, B. Corbett, S. Dorrestein, J. Duis

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

Original languageEnglish
Title of host publicationOptical Interconnects XVI
PublisherInternational Society for Optics and Photonics SPIE
Volume9753
ISBN (Electronic)9781628419887
DOIs
Publication statusPublished - 1 Jan 2016
MoE publication typeA4 Article in a conference publication
EventOptical Interconnects XVI - San Francisco, United States
Duration: 15 Feb 201617 Feb 2016

Conference

ConferenceOptical Interconnects XVI
CountryUnited States
CitySan Francisco
Period15/02/1617/02/16

Fingerprint

Polymer Waveguide
Photonics
Waveguide
Polymers
Waveguides
photonics
waveguides
polymers
Fabrication
Vertical-cavity Surface-emitting Laser (VCSEL)
Substrate
Single Mode
optical coupling
assembly
Surface emitting lasers
glass fibers
Glass fibers
fabrication
Fiber
Substrates

Keywords

  • Fiber-coupling
  • Micromirror
  • Nano-imprinting
  • Photonic integration
  • Polymer waveguides

Cite this

Bosman, E., Van Steenberge, G., Boersma, A., Wiegersma, S., Harmsma, P., Karppinen, M., ... Duis, J. (2016). Scalable electro-photonic integration concept based on polymer waveguides. In Optical Interconnects XVI (Vol. 9753). [97530G] International Society for Optics and Photonics SPIE. https://doi.org/10.1117/12.2225304
Bosman, E. ; Van Steenberge, G. ; Boersma, A. ; Wiegersma, S. ; Harmsma, P. ; Karppinen, M. ; Korhonen, T. ; Offrein, B. J. ; Dangel, R. ; Daly, A. ; Ortsiefer, M. ; Justice, J. ; Corbett, B. ; Dorrestein, S. ; Duis, J. / Scalable electro-photonic integration concept based on polymer waveguides. Optical Interconnects XVI. Vol. 9753 International Society for Optics and Photonics SPIE, 2016.
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Bosman, E, Van Steenberge, G, Boersma, A, Wiegersma, S, Harmsma, P, Karppinen, M, Korhonen, T, Offrein, BJ, Dangel, R, Daly, A, Ortsiefer, M, Justice, J, Corbett, B, Dorrestein, S & Duis, J 2016, Scalable electro-photonic integration concept based on polymer waveguides. in Optical Interconnects XVI. vol. 9753, 97530G, International Society for Optics and Photonics SPIE, Optical Interconnects XVI, San Francisco, United States, 15/02/16. https://doi.org/10.1117/12.2225304

Scalable electro-photonic integration concept based on polymer waveguides. / Bosman, E.; Van Steenberge, G.; Boersma, A.; Wiegersma, S.; Harmsma, P.; Karppinen, M.; Korhonen, T.; Offrein, B. J.; Dangel, R.; Daly, A.; Ortsiefer, M.; Justice, J.; Corbett, B.; Dorrestein, S.; Duis, J.

Optical Interconnects XVI. Vol. 9753 International Society for Optics and Photonics SPIE, 2016. 97530G.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Bosman, E.

AU - Van Steenberge, G.

AU - Boersma, A.

AU - Wiegersma, S.

AU - Harmsma, P.

AU - Karppinen, M.

AU - Korhonen, T.

AU - Offrein, B. J.

AU - Dangel, R.

AU - Daly, A.

AU - Ortsiefer, M.

AU - Justice, J.

AU - Corbett, B.

AU - Dorrestein, S.

AU - Duis, J.

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N2 - A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

AB - A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to glass fiber arrays providing the I/O's. The low cost approach for the polymer waveguide fabrication is based on the nano-imprinting of a spin-coated waveguide core layer. The assembly of VCSELs and photodiodes is performed before waveguide layers are applied. By embedding these components in deep reactive ion etched pockets in the silicon substrate, the planarity of the substrate for subsequent layer processing is guaranteed and the thermal path of chip-to-substrate is minimized. Optical coupling of the embedded devices to the nano-imprinted waveguides is performed by laser ablating 45 degree trenches which act as optical mirror for 90 degree deviation of the light from VCSEL to waveguide. Laser ablation is also implemented for removing parts of the polymer stack in order to mount a custom fabricated connector containing glass fiber arrays. A demonstration device was built to show the proof of principle of the novel fabrication, packaging and optical coupling principles as described above, combined with a set of sub-demonstrators showing the functionality of the different techniques separately. The paper represents a significant part of the electro-photonic integration accomplishments in the European 7th Framework project "Firefly" and not only discusses the development of the different assembly processes described above, but the efforts on the complete integration of all process approaches into the single device demonstrator.

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KW - Micromirror

KW - Nano-imprinting

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Bosman E, Van Steenberge G, Boersma A, Wiegersma S, Harmsma P, Karppinen M et al. Scalable electro-photonic integration concept based on polymer waveguides. In Optical Interconnects XVI. Vol. 9753. International Society for Optics and Photonics SPIE. 2016. 97530G https://doi.org/10.1117/12.2225304