Skip to main navigation Skip to search Skip to main content

Scaling up MnCo2O4 ALD Process for Coating SOFC Interconnect Plates

    • University of Jyväskylä
    • Aalto University
    • Victor Green & Co.

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

    Abstract

    Solid oxide fuel cells (SOFCs) are an interesting choice for an energy production because of their high effi-ciency, low emission rate and fuel flexibility. Metallic interconnect (IC) plates, which separate fuel and oxidant from each other, act as electrical and thermal conductors between adjacent cells and give mechanical support to stack structure. Nevertheless, metallic IC plates suffer from oxidation and degradation at SOFC operating temperatures of 600 - 800 °C. Thus, they need protective coatings, of which the spinel structured MnCo2O4 has drawn attention recently. It has been previously deposited by ALD onto small sized R&D (e.g. 2.5 x 2.5 cm2) substrates. Here we report scaling up the MnCo2O4 ALD process onto 9 x 9 cm2 ferritic stainless steel interconnect plates for solid oxide fuel cells applications. Also the deposition efficiency and cost estimation for the further scaling up is dis-cussed in detail
    Original languageEnglish
    Title of host publicationTechnical Program & Abstracts
    PublisherAmerican Vacuum Society (AVS)
    Publication statusPublished - 2014
    Event14th International Conference on Atomic Layer Deposition, ALD 2014 - Kyoto, Japan
    Duration: 15 Jun 201418 Jun 2014
    Conference number: 14

    Conference

    Conference14th International Conference on Atomic Layer Deposition, ALD 2014
    Abbreviated titleALD 2014
    Country/TerritoryJapan
    CityKyoto
    Period15/06/1418/06/14

    UN SDGs

    This output contributes to the following UN Sustainable Development Goals (SDGs)

    1. SDG 7 - Affordable and Clean Energy
      SDG 7 Affordable and Clean Energy

    Keywords

    • thin films
    • ALD
    • solid oxide fuel cells

    Fingerprint

    Dive into the research topics of 'Scaling up MnCo2O4 ALD Process for Coating SOFC Interconnect Plates'. Together they form a unique fingerprint.

    Cite this