Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

Manu Kujala; Terho Kololuoma; Jari Keskinen; Donald Lupo; Matti Mäntysalo; Thomas Kraft

doi:10.1109/IFETC.2018.8583967

Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

Manu Kujala, Terho Kololuoma, Jari Keskinen, Donald Lupo, Matti Mäntysalo, Thomas Kraft

Tampere University of Technology (TUT)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

12 Citations (Scopus)

Abstract

This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

Original language	English
Title of host publication	2018 International Flexible Electronics Technology Conference, IFETC 2018
Publisher	IEEE Institute of Electrical and Electronic Engineers
Number of pages	6
ISBN (Electronic)	978-1-5386-3357-1, 978-1-5386-3358-8
ISBN (Print)	978-1-5386-3358-8
DOIs	https://doi.org/10.1109/IFETC.2018.8583967
Publication status	Published - 20 Dec 2018
MoE publication type	A4 Article in a conference publication
Event	2018 International Flexible Electronics Technology Conference, IFETC: The future is flexible - Ottawa, Canada Duration: 7 Aug 2018 → 9 Aug 2018 http://2018.ieee-ifetc.org/

Conference

Conference	2018 International Flexible Electronics Technology Conference, IFETC
Abbreviated title	IFETC
Country/Territory	Canada
City	Ottawa
Period	7/08/18 → 9/08/18
Internet address	http://2018.ieee-ifetc.org/

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10.1109/IFETC.2018.8583967

Cite this

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title = "Screen Printed Vias for a Flexible Energy Harvesting and Storage Module",

abstract = "This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.",

author = "Manu Kujala and Terho Kololuoma and Jari Keskinen and Donald Lupo and Matti M{\"a}ntysalo and Thomas Kraft",

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Kujala, M, Kololuoma, T, Keskinen, J, Lupo, D, Mäntysalo, M & Kraft, T 2018, Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. in 2018 International Flexible Electronics Technology Conference, IFETC 2018., 8583967, IEEE Institute of Electrical and Electronic Engineers, 2018 International Flexible Electronics Technology Conference, IFETC, Ottawa, Ontario, Canada, 7/08/18. https://doi.org/10.1109/IFETC.2018.8583967

Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. / Kujala, Manu; Kololuoma, Terho; Keskinen, Jari et al.
2018 International Flexible Electronics Technology Conference, IFETC 2018. IEEE Institute of Electrical and Electronic Engineers, 2018. 8583967.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Kololuoma, Terho

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AU - Lupo, Donald

AU - Mäntysalo, Matti

AU - Kraft, Thomas

PY - 2018/12/20

Y1 - 2018/12/20

N2 - This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

AB - This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

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M3 - Conference article in proceedings

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BT - 2018 International Flexible Electronics Technology Conference, IFETC 2018

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2018 International Flexible Electronics Technology Conference, IFETC

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ER -

Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

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