Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

Manu Kujala, Terho Kololuoma, Jari Keskinen, Donald Lupo, Matti Mäntysalo, Thomas Kraft

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.
Original languageEnglish
Title of host publication2018 International Flexible Electronics Technology Conference, IFETC 2018
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages6
ISBN (Electronic)978-1-5386-3357-1, 978-1-5386-3358-8
ISBN (Print)978-1-5386-3358-8
DOIs
Publication statusPublished - 20 Dec 2018
MoE publication typeNot Eligible
Event2018 International Flexible Electronics Technology Conference, IFETC: The future is flexible - Ottawa, Canada
Duration: 7 Aug 20189 Aug 2018
http://2018.ieee-ifetc.org/

Conference

Conference2018 International Flexible Electronics Technology Conference, IFETC
Abbreviated titleIFETC
CountryCanada
CityOttawa
Period7/08/189/08/18
Internet address

Fingerprint

Screen printing
Energy harvesting
Energy storage
Ink
Silver
Bending tests
Viscosity
Fabrication
Electronic equipment
Electrolytes
Electrodes
Carbon
Lasers

Cite this

Kujala, M., Kololuoma, T., Keskinen, J., Lupo, D., Mäntysalo, M., & Kraft, T. (2018). Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. In 2018 International Flexible Electronics Technology Conference, IFETC 2018 [8583967] IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/IFETC.2018.8583967
Kujala, Manu ; Kololuoma, Terho ; Keskinen, Jari ; Lupo, Donald ; Mäntysalo, Matti ; Kraft, Thomas. / Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. 2018 International Flexible Electronics Technology Conference, IFETC 2018. IEEE Institute of Electrical and Electronic Engineers , 2018.
@inproceedings{ddfc2f9479e54155af8e1c6042d36167,
title = "Screen Printed Vias for a Flexible Energy Harvesting and Storage Module",
abstract = "This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 {\%} yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.",
author = "Manu Kujala and Terho Kololuoma and Jari Keskinen and Donald Lupo and Matti M{\"a}ntysalo and Thomas Kraft",
year = "2018",
month = "12",
day = "20",
doi = "10.1109/IFETC.2018.8583967",
language = "English",
isbn = "978-1-5386-3358-8",
booktitle = "2018 International Flexible Electronics Technology Conference, IFETC 2018",
publisher = "IEEE Institute of Electrical and Electronic Engineers",
address = "United States",

}

Kujala, M, Kololuoma, T, Keskinen, J, Lupo, D, Mäntysalo, M & Kraft, T 2018, Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. in 2018 International Flexible Electronics Technology Conference, IFETC 2018., 8583967, IEEE Institute of Electrical and Electronic Engineers , 2018 International Flexible Electronics Technology Conference, IFETC, Ottawa, Canada, 7/08/18. https://doi.org/10.1109/IFETC.2018.8583967

Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. / Kujala, Manu; Kololuoma, Terho; Keskinen, Jari; Lupo, Donald; Mäntysalo, Matti; Kraft, Thomas.

2018 International Flexible Electronics Technology Conference, IFETC 2018. IEEE Institute of Electrical and Electronic Engineers , 2018. 8583967.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

AU - Kujala, Manu

AU - Kololuoma, Terho

AU - Keskinen, Jari

AU - Lupo, Donald

AU - Mäntysalo, Matti

AU - Kraft, Thomas

PY - 2018/12/20

Y1 - 2018/12/20

N2 - This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

AB - This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode).The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the vias are coated as the via size increases (≥ 150 μm diameter). Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

UR - http://www.scopus.com/inward/record.url?scp=85060723799&partnerID=8YFLogxK

U2 - 10.1109/IFETC.2018.8583967

DO - 10.1109/IFETC.2018.8583967

M3 - Conference article in proceedings

SN - 978-1-5386-3358-8

BT - 2018 International Flexible Electronics Technology Conference, IFETC 2018

PB - IEEE Institute of Electrical and Electronic Engineers

ER -

Kujala M, Kololuoma T, Keskinen J, Lupo D, Mäntysalo M, Kraft T. Screen Printed Vias for a Flexible Energy Harvesting and Storage Module. In 2018 International Flexible Electronics Technology Conference, IFETC 2018. IEEE Institute of Electrical and Electronic Engineers . 2018. 8583967 https://doi.org/10.1109/IFETC.2018.8583967