Screening of ALD thin films for Cu diffusion barrier applications

Riikka L. Puurunen; Jaakko Salonen; Arto  Nurmela; Oili Ylivaara; Heikki Viljanen; Jyrki Molarius; Philippe Monnoyer; Sanna Yliniemi; Marko Pudas; Tero Lehto; Tero Lehto; Wei-Min Li

Screening of ALD thin films for Cu diffusion barrier applications

Riikka L. Puurunen (Corresponding author), Jaakko Salonen, Arto Nurmela, Oili Ylivaara, Heikki Viljanen, Jyrki Molarius, Philippe Monnoyer, Sanna Yliniemi, Marko Pudas, Tero Lehto, Tero Lehto, Wei-Min Li

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Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific

Original language	English
Title of host publication	Technical Program & Abstracts
Publisher	American Vacuum Society (AVS)
Publication status	Published - 2013
Event	13th International Conference on Atomic Layer Deposition, ALD 2013 - San Diego, California, San Diego, United States Duration: 28 Jul 2013 → 31 Jul 2013 Conference number: 13

Conference

Conference	13th International Conference on Atomic Layer Deposition, ALD 2013
Abbreviated title	ALD 2013
Country/Territory	United States
City	San Diego
Period	28/07/13 → 31/07/13

Cite this

@inbook{472ead77ec2b43afac393cea7c8f0350,

title = "Screening of ALD thin films for Cu diffusion barrier applications",

author = "Puurunen, {Riikka L.} and Jaakko Salonen and Arto Nurmela and Oili Ylivaara and Heikki Viljanen and Jyrki Molarius and Philippe Monnoyer and Sanna Yliniemi and Marko Pudas and Tero Lehto and Tero Lehto and Wei-Min Li",

note = "Published abstract of a poster 74717 MECHALD; 13th International Conference on Atomic Layer Deposition, ALD 2013, ALD 2013 ; Conference date: 28-07-2013 Through 31-07-2013",

year = "2013",

language = "English",

booktitle = "Technical Program & Abstracts",

publisher = "American Vacuum Society (AVS)",

address = "United States",

}

Puurunen, RL, Salonen, J, Nurmela, A, Ylivaara, O, Viljanen, H, Molarius, J, Monnoyer, P, Yliniemi, S, Pudas, M, Lehto, T, Lehto, T & Li, W-M 2013, Screening of ALD thin films for Cu diffusion barrier applications. in Technical Program & Abstracts. American Vacuum Society (AVS), 13th International Conference on Atomic Layer Deposition, ALD 2013, San Diego, California, United States, 28/07/13.

TY - CHAP

T1 - Screening of ALD thin films for Cu diffusion barrier applications

AU - Puurunen, Riikka L.

AU - Salonen, Jaakko

AU - Nurmela, Arto

AU - Ylivaara, Oili

AU - Viljanen, Heikki

AU - Molarius, Jyrki

AU - Monnoyer, Philippe

AU - Yliniemi, Sanna

AU - Pudas, Marko

AU - Lehto, Tero

AU - Li, Wei-Min

N1 - Conference code: 13

PY - 2013

Y1 - 2013

M3 - Conference abstract in proceedings

BT - Technical Program & Abstracts

PB - American Vacuum Society (AVS)

T2 - 13th International Conference on Atomic Layer Deposition, ALD 2013

Y2 - 28 July 2013 through 31 July 2013

ER -