Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

Kestutis Grigoras; Aapo Varpula; Corinna Grosse; Daniel May; Mohamad Abo Ras; Mika Prunnila

doi:10.3390/proceedings2130883

Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

Kestutis Grigoras (Corresponding Author), Aapo Varpula, Corinna Grosse, Daniel May, Mohamad Abo Ras, Mika Prunnila

Research output: Contribution to journal › Article in a proceedings journal › Scientific › peer-review

Abstract

Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.

Original language	English
Article number	883
Number of pages	5
Journal	Proceedings
Volume	2
Issue number	13
DOIs	https://doi.org/10.3390/proceedings2130883
Publication status	Published - 28 Nov 2018
MoE publication type	Not Eligible
Event	Eurosensors 2018 Conference - Graz, Austria Duration: 9 Sept 2018 → 12 Dec 2018 Conference number: 32 https://eurosensors2018.eu/

Keywords

thermal conductivity
3-omega method
porous silicon
glass
microfabrication
atomic layer deposition
OtaNano

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.3390/proceedings2130883Licence: CC BY

Cite this

@article{91a3f6156ca34f4aa6778d788de3b4ae,

title = "Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method",

abstract = "Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.",

keywords = "thermal conductivity, 3-omega method, porous silicon, glass, microfabrication, atomic layer deposition, OtaNano",

author = "Kestutis Grigoras and Aapo Varpula and Corinna Grosse and Daniel May and Ras, {Mohamad Abo} and Mika Prunnila",

year = "2018",

month = nov,

day = "28",

doi = "10.3390/proceedings2130883",

language = "English",

volume = "2",

journal = "Proceedings",

issn = "2504-3900",

publisher = "MDPI",

number = "13",

note = "Eurosensors 2018 Conference, EUROSENSORS 2018 ; Conference date: 09-09-2018 Through 12-12-2018",

url = "https://eurosensors2018.eu/",

}

TY - JOUR

T1 - Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

AU - Grigoras, Kestutis

AU - Varpula, Aapo

AU - Grosse, Corinna

AU - May, Daniel

AU - Ras, Mohamad Abo

AU - Prunnila, Mika

N1 - Conference code: 32

PY - 2018/11/28

Y1 - 2018/11/28

N2 - Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.

AB - Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.

KW - thermal conductivity

KW - 3-omega method

KW - porous silicon

KW - glass

KW - microfabrication

KW - atomic layer deposition

KW - OtaNano

UR - https://www.mdpi.com/2504-3900/2/13/883

U2 - 10.3390/proceedings2130883

DO - 10.3390/proceedings2130883

M3 - Article in a proceedings journal

SN - 2504-3900

VL - 2

JO - Proceedings

JF - Proceedings

IS - 13

M1 - 883

T2 - Eurosensors 2018 Conference

Y2 - 9 September 2018 through 12 December 2018

ER -

Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

Abstract

Keywords

UN SDGs

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ALDCoE: Finnish Centre of Excellence in Atomic Layer Deposition

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Cite this

Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

Abstract

Keywords

UN SDGs

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Other files and links

Fingerprint

Projects

ALDCoE: Finnish Centre of Excellence in Atomic Layer Deposition

Equipment

OtaNano

Cite this