Short and long term reliability of inmould sealed bare and glob-top shielded LED chips

Kimmo Keränen, Mikko Silvennoinen, Ari Lehto, Jyrki Ollila, Timo Salmi, Jukka-Tapani Mäkinen, Anneli Ojapalo, Marcus Schorpp, Pekka Hoskio, Pentti Karioja

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publication16th European Microelectronics and Packaging Conference and Exhibition 2007
    Subtitle of host publicationEMPC 2007
    PublisherCurran Associates Inc.
    Pages280-284
    ISBN (Print)978-1-62276-466-2
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
    Duration: 17 Jun 200720 Jun 2007
    Conference number: 16

    Conference

    Conference16th European Microelectronics and Packaging Conference and Exhibition
    Abbreviated titleEMPC 2007
    Country/TerritoryFinland
    CityOulu
    Period17/06/0720/06/07

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