Short and long term reliability of inmould sealed bare and glob-top shielded LED chips

Kimmo Keränen, Mikko Silvennoinen, Ari Lehto, Jyrki Ollila, Timo Salmi, Jukka-Tapani Mäkinen, Anneli Ojapalo, Marcus Schorpp, Pekka Hoskio, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition 2007
Subtitle of host publicationEMPC 2007
PublisherCurran Associates Inc.
Pages280-284
ISBN (Print)978-1-62276-466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Keränen, K., Silvennoinen, M., Lehto, A., Ollila, J., Salmi, T., Mäkinen, J-T., ... Karioja, P. (2007). Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. In 16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007 (pp. 280-284). Curran Associates Inc..
Keränen, Kimmo ; Silvennoinen, Mikko ; Lehto, Ari ; Ollila, Jyrki ; Salmi, Timo ; Mäkinen, Jukka-Tapani ; Ojapalo, Anneli ; Schorpp, Marcus ; Hoskio, Pekka ; Karioja, Pentti. / Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. 16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007. Curran Associates Inc., 2007. pp. 280-284
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title = "Short and long term reliability of inmould sealed bare and glob-top shielded LED chips",
author = "Kimmo Ker{\"a}nen and Mikko Silvennoinen and Ari Lehto and Jyrki Ollila and Timo Salmi and Jukka-Tapani M{\"a}kinen and Anneli Ojapalo and Marcus Schorpp and Pekka Hoskio and Pentti Karioja",
year = "2007",
language = "English",
isbn = "978-1-62276-466-2",
pages = "280--284",
booktitle = "16th European Microelectronics and Packaging Conference and Exhibition 2007",
publisher = "Curran Associates Inc.",
address = "United States",

}

Keränen, K, Silvennoinen, M, Lehto, A, Ollila, J, Salmi, T, Mäkinen, J-T, Ojapalo, A, Schorpp, M, Hoskio, P & Karioja, P 2007, Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. in 16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007. Curran Associates Inc., pp. 280-284, 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. / Keränen, Kimmo; Silvennoinen, Mikko; Lehto, Ari; Ollila, Jyrki; Salmi, Timo; Mäkinen, Jukka-Tapani; Ojapalo, Anneli; Schorpp, Marcus; Hoskio, Pekka; Karioja, Pentti.

16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007. Curran Associates Inc., 2007. p. 280-284.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Short and long term reliability of inmould sealed bare and glob-top shielded LED chips

AU - Keränen, Kimmo

AU - Silvennoinen, Mikko

AU - Lehto, Ari

AU - Ollila, Jyrki

AU - Salmi, Timo

AU - Mäkinen, Jukka-Tapani

AU - Ojapalo, Anneli

AU - Schorpp, Marcus

AU - Hoskio, Pekka

AU - Karioja, Pentti

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 978-1-62276-466-2

SP - 280

EP - 284

BT - 16th European Microelectronics and Packaging Conference and Exhibition 2007

PB - Curran Associates Inc.

ER -

Keränen K, Silvennoinen M, Lehto A, Ollila J, Salmi T, Mäkinen J-T et al. Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. In 16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007. Curran Associates Inc. 2007. p. 280-284