Short and long term reliability of inmould sealed bare and glob-top shielded LED chips

Kimmo Keränen, Mikko Silvennoinen, Ari Lehto, Jyrki Ollila, Timo Salmi, Jukka-Tapani Mäkinen, Anneli Ojapalo, Marcus Schorpp, Pekka Hoskio, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition 2007
Subtitle of host publicationEMPC 2007
PublisherCurran Associates Inc.
Pages280-284
ISBN (Print)978-1-62276-466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Keränen, K., Silvennoinen, M., Lehto, A., Ollila, J., Salmi, T., Mäkinen, J-T., Ojapalo, A., Schorpp, M., Hoskio, P., & Karioja, P. (2007). Short and long term reliability of inmould sealed bare and glob-top shielded LED chips. In 16th European Microelectronics and Packaging Conference and Exhibition 2007: EMPC 2007 (pp. 280-284). Curran Associates Inc..