Silicon Direct Bonding

Engineering

• Applications 50%
• Bonded Interface 16%
• Chemical Vapor Deposition 33%
• Direct Bonding 66%
• Hydrophilic 16%
• Hydrophobic 33%
• Microelectromechanical System 33%
• Oxide Layer 16%
• Plasma Activation 16%
• Polysilicon 16%
• Room Temperature 33%
• Silicon 100%
• Silicon Wafer 66%
• Surface Layer 16%
• Surfaces 33%
• Wafer Bonding 16%

Material Science

• Crystallization 16%
• Epitaxy 16%
• Glass 16%
• Oxide 66%
• Silicon Wafer 66%
• Surface 33%
• Surface Roughness 16%