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Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

  • Riikka L. Puurunen*
  • , T. Suni
  • , Oili M.E. Ylivaara
  • , H. Kondo
  • , M. Ammar
  • , T. Ishida
  • , H. Fujita
  • , A. Bosseboeuf
  • , S. Zaima
  • , Hannu Kattelus
    • *Corresponding author for this work
    • VTT (former employee or external)
    • University of Tokyo
    • Nagoya University
    • University of Paris-Saclay

    Research output: Contribution to journal › Article › Scientific › peer-review

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