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Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films
Riikka L. Puurunen*, T. Suni, Oili M.E. Ylivaara, H. Kondo, M. Ammar, T. Ishida, H. Fujita, A. Bosseboeuf, S. Zaima, Hannu Kattelus
*Corresponding author for this work
Research output: Contribution to journal › Article › Scientific › peer-review
15
Citations
(Scopus)