Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

R. L. Puurunen (Corresponding Author), T. Suni, O. M.E. Ylivaara, H. Kondo, M. Ammar, T. Ishida, H. Fujita, A. Bosseboeuf, S. Zaima, H. Kattelus

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    14 Citations (Scopus)

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