Abstract
The paper presents utilization of Silicon-micromachined waveguide systems as a packaging solution for Sub-THz and THz active MMICs. The developed integration process relies on deep reactive ion etching micromachining and Au-Au wafer bonding technologies. The fabrication process includes only standard fabrication steps that can be automated and allows integration of individual MMICs of different technologies into the same Silicon module. The process is scalable and cost efficient for future sub-THz and THz communication and sensing applications. The technology is demonstrated with packaging of a low noise amplifier at frequency range of 190 – 240 GHz. Combination of the proposed integration technology with a flip chip interconnection allows obtaining the gain of the packaged LNA like the LNA on a chip.
| Original language | English |
|---|---|
| Title of host publication | 2024 54th European Microwave Conference (EuMC) |
| Publisher | Wiley-IEEE Press |
| Pages | 581-584 |
| Number of pages | 4 |
| ISBN (Electronic) | 9782874870774 |
| ISBN (Print) | 979-8-3503-8589-2 |
| DOIs | |
| Publication status | Published - 26 Sept 2024 |
| MoE publication type | A4 Article in a conference publication |
| Event | 54th European Microwave Conference, EuMC 2024 - Paris, France Duration: 24 Sept 2024 → 26 Sept 2024 |
Conference
| Conference | 54th European Microwave Conference, EuMC 2024 |
|---|---|
| Country/Territory | France |
| City | Paris |
| Period | 24/09/24 → 26/09/24 |
Keywords
- Fabrication
- Wafer bonding
- Costs
- Integrated circuit interconnections
- Packaging
- Silicon
- Sensors
- Flip-chip devices
- Standards
- Terahertz communications
- micromachining
- terahertz (THz)
- integration
