Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits

Vladimir Ermolov; Antti Lamminen; Mikko Varonen; Henri Ailas; Markku Lahti; Henrik Forstén; Mikko Kaunisto; Mikko Kantanen; Dristy Parveg; Pekka Pursula

doi:10.23919/EuMC61614.2024.10732737

Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

The paper presents utilization of Silicon-micromachined waveguide systems as a packaging solution for Sub-THz and THz active MMICs. The developed integration process relies on deep reactive ion etching micromachining and Au-Au wafer bonding technologies. The fabrication process includes only standard fabrication steps that can be automated and allows integration of individual MMICs of different technologies into the same Silicon module. The process is scalable and cost efficient for future sub-THz and THz communication and sensing applications. The technology is demonstrated with packaging of a low noise amplifier at frequency range of 190 – 240 GHz. Combination of the proposed integration technology with a flip chip interconnection allows obtaining the gain of the packaged LNA like the LNA on a chip.

Original language	English
Title of host publication	2024 54th European Microwave Conference (EuMC)
Publisher	Wiley-IEEE Press
Pages	581-584
Number of pages	4
ISBN (Electronic)	9782874870774
ISBN (Print)	979-8-3503-8589-2
DOIs	https://doi.org/10.23919/EuMC61614.2024.10732737
Publication status	Published - 26 Sept 2024
MoE publication type	A4 Article in a conference publication
Event	54th European Microwave Conference, EuMC 2024 - Paris, France Duration: 24 Sept 2024 → 26 Sept 2024

Conference

Conference	54th European Microwave Conference, EuMC 2024
Country/Territory	France
City	Paris
Period	24/09/24 → 26/09/24

Funding

This work was supported by the Academy of Finland through MilliRAD (decision no 314542), TeraCom (decision no 319681), and MIDERI (decision no 310234) projects, and by Business Finland through TeraFront project (decision number 8398/31/2022).

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Fabrication
Wafer bonding
Costs
Integrated circuit interconnections
Packaging
Silicon
Sensors
Flip-chip devices
Standards
Terahertz communications
micromachining
terahertz (THz)
integration

Access to Document

10.23919/EuMC61614.2024.10732737

Cite this

Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D., & Pursula, P. (2024). Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits. In 2024 54th European Microwave Conference (EuMC) (pp. 581-584). Article 10732737 Wiley-IEEE Press. https://doi.org/10.23919/EuMC61614.2024.10732737

@inproceedings{09185eb1f44249aca1e636cd6eb717df,

title = "Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits",

abstract = "The paper presents utilization of Silicon-micromachined waveguide systems as a packaging solution for Sub-THz and THz active MMICs. The developed integration process relies on deep reactive ion etching micromachining and Au-Au wafer bonding technologies. The fabrication process includes only standard fabrication steps that can be automated and allows integration of individual MMICs of different technologies into the same Silicon module. The process is scalable and cost efficient for future sub-THz and THz communication and sensing applications. The technology is demonstrated with packaging of a low noise amplifier at frequency range of 190 – 240 GHz. Combination of the proposed integration technology with a flip chip interconnection allows obtaining the gain of the packaged LNA like the LNA on a chip.",

keywords = "Fabrication, Wafer bonding, Costs, Integrated circuit interconnections, Packaging, Silicon, Sensors, Flip-chip devices, Standards, Terahertz communications, micromachining, terahertz (THz), integration",

author = "Vladimir Ermolov and Antti Lamminen and Mikko Varonen and Henri Ailas and Markku Lahti and Henrik Forst{\'e}n and Mikko Kaunisto and Mikko Kantanen and Dristy Parveg and Pekka Pursula",

year = "2024",

month = sep,

day = "26",

doi = "10.23919/EuMC61614.2024.10732737",

language = "English",

isbn = "979-8-3503-8589-2",

pages = "581--584",

booktitle = "2024 54th European Microwave Conference (EuMC)",

publisher = "Wiley-IEEE Press",

address = "United States",

note = " 54th European Microwave Conference, EuMC 2024 ; Conference date: 24-09-2024 Through 26-09-2024",

}

Ermolov, V , Lamminen, A , Varonen, M , Ailas, H , Lahti, M, Forstén, H, Kaunisto, M , Kantanen, M , Parveg, D & Pursula, P 2024, Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits. in 2024 54th European Microwave Conference (EuMC)., 10732737, Wiley-IEEE Press, pp. 581-584, 54th European Microwave Conference, EuMC 2024, Paris, France, 24/09/24. https://doi.org/10.23919/EuMC61614.2024.10732737

Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits. / Ermolov, Vladimir ; Lamminen, Antti ; Varonen, Mikko et al.
2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, 2024. p. 581-584 10732737.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits

AU - Ermolov, Vladimir

AU - Lamminen, Antti

AU - Varonen, Mikko

AU - Ailas, Henri

AU - Lahti, Markku

AU - Forstén, Henrik

AU - Kaunisto, Mikko

AU - Kantanen, Mikko

AU - Parveg, Dristy

AU - Pursula, Pekka

PY - 2024/9/26

Y1 - 2024/9/26

N2 - The paper presents utilization of Silicon-micromachined waveguide systems as a packaging solution for Sub-THz and THz active MMICs. The developed integration process relies on deep reactive ion etching micromachining and Au-Au wafer bonding technologies. The fabrication process includes only standard fabrication steps that can be automated and allows integration of individual MMICs of different technologies into the same Silicon module. The process is scalable and cost efficient for future sub-THz and THz communication and sensing applications. The technology is demonstrated with packaging of a low noise amplifier at frequency range of 190 – 240 GHz. Combination of the proposed integration technology with a flip chip interconnection allows obtaining the gain of the packaged LNA like the LNA on a chip.

AB - The paper presents utilization of Silicon-micromachined waveguide systems as a packaging solution for Sub-THz and THz active MMICs. The developed integration process relies on deep reactive ion etching micromachining and Au-Au wafer bonding technologies. The fabrication process includes only standard fabrication steps that can be automated and allows integration of individual MMICs of different technologies into the same Silicon module. The process is scalable and cost efficient for future sub-THz and THz communication and sensing applications. The technology is demonstrated with packaging of a low noise amplifier at frequency range of 190 – 240 GHz. Combination of the proposed integration technology with a flip chip interconnection allows obtaining the gain of the packaged LNA like the LNA on a chip.

KW - Fabrication

KW - Wafer bonding

KW - Costs

KW - Integrated circuit interconnections

KW - Packaging

KW - Silicon

KW - Sensors

KW - Flip-chip devices

KW - Standards

KW - Terahertz communications

KW - micromachining

KW - terahertz (THz)

KW - integration

UR - https://www.scopus.com/pages/publications/85210596928

U2 - 10.23919/EuMC61614.2024.10732737

DO - 10.23919/EuMC61614.2024.10732737

M3 - Conference article in proceedings

SN - 979-8-3503-8589-2

SP - 581

EP - 584

BT - 2024 54th European Microwave Conference (EuMC)

PB - Wiley-IEEE Press

T2 - 54th European Microwave Conference, EuMC 2024

Y2 - 24 September 2024 through 26 September 2024

ER -

Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits

Abstract

Conference

Funding

UN SDGs

Keywords

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