Simulation of TIM and PCM applications in building envelopes

Mikael Salonvaara, Tuomo Ojanen, Reijo Kohonen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publicationIEA-Workshop on Thermal Energy Storage and Low Energy Buildings
    Subtitle of host publicationWorkshop Proceedings
    EditorsWolfgang Schölkopf
    Place of PublicationTutzing
    Pages125-132
    Publication statusPublished - 1991
    MoE publication typeA4 Article in a conference publication
    EventIEA-Workshop on Thermal Energy Storage and Low Energy Buildings - Tutzing, Germany
    Duration: 18 Jun 199119 Jun 1991

    Conference

    ConferenceIEA-Workshop on Thermal Energy Storage and Low Energy Buildings
    CountryGermany
    CityTutzing
    Period18/06/9119/06/91

    Cite this

    Salonvaara, M., Ojanen, T., & Kohonen, R. (1991). Simulation of TIM and PCM applications in building envelopes. In W. Schölkopf (Ed.), IEA-Workshop on Thermal Energy Storage and Low Energy Buildings: Workshop Proceedings (pp. 125-132).