Sizing method for board

Antti Heikkinen (Inventor), Mikko Tani (Inventor), Vesa Huovila (Inventor), Elias Retulainen (Inventor)

Research output: PatentPatent application

Abstract

A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

Original languageEnglish
Patent numberUS2005072541
IPCD21H 27/ 10 A N
Priority date13/12/02
Publication statusPublished - 7 Apr 2005
MoE publication typeNot Eligible

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Heikkinen, A., Tani, M., Huovila, V., & Retulainen, E. (2005). IPC No. D21H 27/ 10 A N. Sizing method for board. (Patent No. US2005072541).