Sizing method for board

Antti Heikkinen (Inventor), Mikko Tani (Inventor), Vesa Huovila (Inventor), Elias Retulainen (Inventor)

Research output: PatentResearch

Abstract

A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

Original languageEnglish
Patent numberUS2005072541
IPCD21H 27/ 10 A N
Priority date13/12/02
Publication statusPublished - 7 Apr 2005
MoE publication typeNot Eligible

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sorption
wetting
method
sizing
water
adhesive
process water

Cite this

Heikkinen, A., Tani, M., Huovila, V., & Retulainen, E. (2005). IPC No. D21H 27/ 10 A N. Sizing method for board. (Patent No. US2005072541).
Heikkinen, Antti (Inventor) ; Tani, Mikko (Inventor) ; Huovila, Vesa (Inventor) ; Retulainen, Elias (Inventor). / Sizing method for board. IPC No.: D21H 27/ 10 A N. Patent No.: US2005072541.
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author = "Antti Heikkinen and Mikko Tani and Vesa Huovila and Elias Retulainen",
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Heikkinen, A, Tani, M, Huovila, V & Retulainen, E 2005, Sizing method for board, Patent No. US2005072541, IPC No. D21H 27/ 10 A N.

Sizing method for board. / Heikkinen, Antti (Inventor); Tani, Mikko (Inventor); Huovila, Vesa (Inventor); Retulainen, Elias (Inventor).

IPC No.: D21H 27/ 10 A N. Patent No.: US2005072541.

Research output: PatentResearch

TY - PAT

T1 - Sizing method for board

AU - Heikkinen, Antti

AU - Tani, Mikko

AU - Huovila, Vesa

AU - Retulainen, Elias

PY - 2005/4/7

Y1 - 2005/4/7

N2 - A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

AB - A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

M3 - Patent

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ER -

Heikkinen A, Tani M, Huovila V, Retulainen E, inventors. Sizing method for board. D21H 27/ 10 A N. 2005 Apr 7.