Abstract
A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.
| Original language | English |
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| Patent number | US2005072541 |
| IPC | D21H 27/ 10 A N |
| Priority date | 13/12/02 |
| Publication status | Published - 7 Apr 2005 |
| MoE publication type | Not Eligible |