Sizing method for board

Antti Heikkinen; Mikko Tani; Vesa Huovila; Elias Retulainen

Sizing method for board

Antti Heikkinen (Inventor)
, Mikko Tani (Inventor)
, Vesa Huovila (Inventor)
, Elias Retulainen (Inventor)

Research output: Patent › Patent application

Abstract

A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

Original language	English
Patent number	US2005072541
IPC	D21H 27/ 10 A N
Priority date	13/12/02
Publication status	Published - 7 Apr 2005
MoE publication type	Not Eligible

Cite this

@misc{3fcf217f39ee476f8955b467c4b50b1f,

title = "Sizing method for board",

abstract = "A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.",

author = "Antti Heikkinen and Mikko Tani and Vesa Huovila and Elias Retulainen",

year = "2005",

month = apr,

day = "7",

language = "English",

type = "Patent",

note = "US2005072541; D21H 27/ 10 A N",

}

TY - PAT

T1 - Sizing method for board

AU - Heikkinen, Antti

AU - Tani, Mikko

AU - Huovila, Vesa

AU - Retulainen, Elias

PY - 2005/4/7

Y1 - 2005/4/7

N2 - A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

AB - A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

M3 - Patent

M1 - US2005072541

ER -

Sizing method for board

Abstract

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