Solder joint reliability in AgPt-metallized LTCC modules

Olli Nousiainen, Risto Rautioaho, Kari Kautio, Jussi Jääskeläinen, Seppo Leppävuori

    Research output: Contribution to journalArticleScientificpeer-review

    15 Citations (Scopus)

    Abstract

    Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.
    Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.
    Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.
    Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.
    Original languageEnglish
    Pages (from-to)32 - 42
    Number of pages11
    JournalSoldering and Surface Mount Technology
    Volume17
    Issue number3
    DOIs
    Publication statusPublished - 2005
    MoE publication typeA1 Journal article-refereed

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    solders
    Soldering alloys
    modules
    ceramics
    Metallizing
    Fatigue of materials
    Temperature
    Masks
    Glazes
    masks
    Polychlorinated Biphenyls
    glazes
    Polychlorinated biphenyls
    cycles
    polychlorinated biphenyls
    endurance
    Energy dispersive spectroscopy
    Durability
    assemblies
    temperature

    Cite this

    Nousiainen, O., Rautioaho, R., Kautio, K., Jääskeläinen, J., & Leppävuori, S. (2005). Solder joint reliability in AgPt-metallized LTCC modules. Soldering and Surface Mount Technology, 17(3), 32 - 42. https://doi.org/10.1108/09540910510613538
    Nousiainen, Olli ; Rautioaho, Risto ; Kautio, Kari ; Jääskeläinen, Jussi ; Leppävuori, Seppo. / Solder joint reliability in AgPt-metallized LTCC modules. In: Soldering and Surface Mount Technology. 2005 ; Vol. 17, No. 3. pp. 32 - 42.
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    title = "Solder joint reliability in AgPt-metallized LTCC modules",
    abstract = "Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.",
    author = "Olli Nousiainen and Risto Rautioaho and Kari Kautio and Jussi J{\"a}{\"a}skel{\"a}inen and Seppo Lepp{\"a}vuori",
    year = "2005",
    doi = "10.1108/09540910510613538",
    language = "English",
    volume = "17",
    pages = "32 -- 42",
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    Nousiainen, O, Rautioaho, R, Kautio, K, Jääskeläinen, J & Leppävuori, S 2005, 'Solder joint reliability in AgPt-metallized LTCC modules', Soldering and Surface Mount Technology, vol. 17, no. 3, pp. 32 - 42. https://doi.org/10.1108/09540910510613538

    Solder joint reliability in AgPt-metallized LTCC modules. / Nousiainen, Olli; Rautioaho, Risto; Kautio, Kari; Jääskeläinen, Jussi; Leppävuori, Seppo.

    In: Soldering and Surface Mount Technology, Vol. 17, No. 3, 2005, p. 32 - 42.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Solder joint reliability in AgPt-metallized LTCC modules

    AU - Nousiainen, Olli

    AU - Rautioaho, Risto

    AU - Kautio, Kari

    AU - Jääskeläinen, Jussi

    AU - Leppävuori, Seppo

    PY - 2005

    Y1 - 2005

    N2 - Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.

    AB - Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.

    U2 - 10.1108/09540910510613538

    DO - 10.1108/09540910510613538

    M3 - Article

    VL - 17

    SP - 32

    EP - 42

    JO - Soldering and Surface Mount Technology

    JF - Soldering and Surface Mount Technology

    SN - 0954-0911

    IS - 3

    ER -