Solder joint reliability in AgPt-metallized LTCC modules

Olli Nousiainen, Risto Rautioaho, Kari Kautio, Jussi Jääskeläinen, Seppo Leppävuori

Research output: Contribution to journalArticleScientificpeer-review

15 Citations (Scopus)

Abstract

Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.
Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.
Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.
Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.
Original languageEnglish
Pages (from-to)32 - 42
Number of pages11
JournalSoldering and Surface Mount Technology
Volume17
Issue number3
DOIs
Publication statusPublished - 2005
MoE publication typeA1 Journal article-refereed

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solders
Soldering alloys
modules
ceramics
Metallizing
Fatigue of materials
Temperature
Masks
Glazes
masks
Polychlorinated Biphenyls
glazes
Polychlorinated biphenyls
cycles
polychlorinated biphenyls
endurance
Energy dispersive spectroscopy
Durability
assemblies
temperature

Cite this

Nousiainen, O., Rautioaho, R., Kautio, K., Jääskeläinen, J., & Leppävuori, S. (2005). Solder joint reliability in AgPt-metallized LTCC modules. Soldering and Surface Mount Technology, 17(3), 32 - 42. https://doi.org/10.1108/09540910510613538
Nousiainen, Olli ; Rautioaho, Risto ; Kautio, Kari ; Jääskeläinen, Jussi ; Leppävuori, Seppo. / Solder joint reliability in AgPt-metallized LTCC modules. In: Soldering and Surface Mount Technology. 2005 ; Vol. 17, No. 3. pp. 32 - 42.
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abstract = "Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.",
author = "Olli Nousiainen and Risto Rautioaho and Kari Kautio and Jussi J{\"a}{\"a}skel{\"a}inen and Seppo Lepp{\"a}vuori",
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Nousiainen, O, Rautioaho, R, Kautio, K, Jääskeläinen, J & Leppävuori, S 2005, 'Solder joint reliability in AgPt-metallized LTCC modules', Soldering and Surface Mount Technology, vol. 17, no. 3, pp. 32 - 42. https://doi.org/10.1108/09540910510613538

Solder joint reliability in AgPt-metallized LTCC modules. / Nousiainen, Olli; Rautioaho, Risto; Kautio, Kari; Jääskeläinen, Jussi; Leppävuori, Seppo.

In: Soldering and Surface Mount Technology, Vol. 17, No. 3, 2005, p. 32 - 42.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Solder joint reliability in AgPt-metallized LTCC modules

AU - Nousiainen, Olli

AU - Rautioaho, Risto

AU - Kautio, Kari

AU - Jääskeläinen, Jussi

AU - Leppävuori, Seppo

PY - 2005

Y1 - 2005

N2 - Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.

AB - Purpose – To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules.Design/methodology/approach – The fatigue performance of six LTCC/PCB assembly versions was investigated using temperature cycling tests in the −40‐125°C and 20‐80°C temperature ranges. In order to eliminate fatigue cracking in the LTCC module itself, large AgPt‐metallized solder (1 mm) lands with organic or co‐fired glaze solder masks, having 0.86‐0.89 mm openings, were used. The performance of these modules was compared to that of AgPd‐metallized modules with a similar solder land structure. The joint structures were analysed using resistance measurements, scanning acoustic microscopy, SEM/EDS investigation, and FEM simulations.Findings – The results showed that failure distributions with Weibull shape factor (β) values from 8.4 to 14.2, and characteristic life time (θ) values between 860 and 1,165 cycles were achieved in AgPt assemblies in the −40‐125°C temperature range. The primary failure mechanism was solder joint cracking, whereas the AgPd‐metallized modules suffered from cracking in the ceramic. In the milder test conditions AgPd‐metallized modules showed better fatigue endurance than AgPt‐metallized modules.Originality/value – This paper proves that the cracking in ceramic in the harsh test condition can be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure.

U2 - 10.1108/09540910510613538

DO - 10.1108/09540910510613538

M3 - Article

VL - 17

SP - 32

EP - 42

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

IS - 3

ER -