Skip to main navigation
Skip to search
Skip to main content
VTT's Research Information Portal Home
Search content at VTT's Research Information Portal
Home
Profiles
Research output
Projects
Datasets
Research units
Research Infrastructures
Activities
Prizes
Press/Media
Impacts
Solder joint reliability in AgPt-metallized LTCC modules
Olli Nousiainen
, Risto Rautioaho
, Kari Kautio
, Jussi Jääskeläinen
, Seppo Leppävuori
University of Oulu
Research output
:
Contribution to journal
›
Article
›
Scientific
›
peer-review
18
Link opens in a new tab
Citations (Scopus)
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Solder joint reliability in AgPt-metallized LTCC modules'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Low Temperature Co-fired Ceramic
100%
Metallized
100%
Ag-Pt
100%
Solder Joint Reliability
100%
Metallization
75%
Temperature Range
50%
Soldering
50%
Solder Mask
50%
Design Methodology
25%
SEM-EDS
25%
Fatigue Endurance
25%
Fatigue Crack
25%
Resistance Measurement
25%
Fatigue Performance
25%
FEM Simulation
25%
Failure Mechanism
25%
Failure Distribution
25%
Scanning Acoustic Microscopy
25%
Weibull Shape Parameter
25%
Lifetime Value
25%
Module Structure
25%
Factor Value
25%
Temperature Cycling Test
25%
Ag-Pd
25%
PCB Assembly
25%
Characteristic Life
25%
Solder Joint Cracks
25%
Land Structure
25%
Primary Failure
25%
Mask Material
25%
Joint Structure
25%
INIS
low temperature
100%
ceramics
100%
reliability
100%
cracking
66%
values
50%
fatigue
50%
failures
33%
performance
33%
temperature range
33%
masks
33%
simulation
16%
comparative evaluations
16%
design
16%
shape
16%
scanning electron microscopy
16%
distribution
16%
investigations
16%
lifetime
16%
pcb
16%
glazes
16%
scanning acoustic microscopy
16%
Engineering
Low-Temperature
100%
Joints (Structural Components)
100%
Metallizations
75%
Test Condition
50%
Temperature Range
50%
Fatigue Performance
25%
Scanning Acoustic Microscopy
25%
Failure Mechanism
25%
Energy dispersive spectrometry
25%
Shape Factor
25%
Material Science
Solder Joint
100%
Scanning Acoustic Microscopy
33%
Scanning Electron Microscopy
33%
Energy-Dispersive X-Ray Spectroscopy
33%