Step and stamp imprint lithography using a commercial flip chip bonder

Tomi Haatainen, Jouni Ahopelto, Gabi Grueztner, Marion Fink, Karl Pfeiffer

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    23 Citations (Scopus)

    Abstract

    In this work we describe a new method suitable for large area nanoimprint lithography. In step&stamp process the pattern on a stamp is transferred into a polymer layer on the substrate by repeating a step&stamp cycle. The method is demonstrated by imprinting matrices of test structures on polymer-coated 100 mm silicon wafers. A new polymer, PPM, is used as resist in the experiments. The polymer has been developed to fulfill the demands of imprint lithography. Patterns with sizes down to 400 nm were imprinted into either 100 nm or 340 nm thick PPM resist. After thinning in oxygen plasma, the resist layer is used as etching mask or for fabrication of interdigitated aluminum fingers by lift-off.
    Original languageEnglish
    Title of host publicationEmerging Lithographic Technologies IV
    PublisherInternational Society for Optics and Photonics SPIE
    Pages874-880
    ISBN (Print)0-8194-3615-1
    DOIs
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Publication series

    SeriesProceedings of SPIE
    Volume3997
    ISSN0277-786X

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    Cite this

    Haatainen, T., Ahopelto, J., Grueztner, G., Fink, M., & Pfeiffer, K. (2000). Step and stamp imprint lithography using a commercial flip chip bonder. In Emerging Lithographic Technologies IV (pp. 874-880). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 3997 https://doi.org/10.1117/12.390036