Step and stamp imprint lithography using a commercial flip chip bonder

Tomi Haatainen, Jouni Ahopelto, Gabi Grueztner, Marion Fink, Karl Pfeiffer

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    24 Citations (Scopus)


    In this work we describe a new method suitable for large area nanoimprint lithography. In step&stamp process the pattern on a stamp is transferred into a polymer layer on the substrate by repeating a step&stamp cycle. The method is demonstrated by imprinting matrices of test structures on polymer-coated 100 mm silicon wafers. A new polymer, PPM, is used as resist in the experiments. The polymer has been developed to fulfill the demands of imprint lithography. Patterns with sizes down to 400 nm were imprinted into either 100 nm or 340 nm thick PPM resist. After thinning in oxygen plasma, the resist layer is used as etching mask or for fabrication of interdigitated aluminum fingers by lift-off.
    Original languageEnglish
    Title of host publicationEmerging Lithographic Technologies IV
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)0-8194-3615-1
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Publication series

    SeriesProceedings of SPIE


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