Stress in atomic layer deposited aluminium oxide and titanium dioxide thin films

Oili Ylivaara (Corresponding author), Riikka L. Puurunen, Mikko Laitinen, Sakari Sintonen, Saima Ali, Timo Sajavaara, Harri Lipsanen, Jyrki Kiihamäki

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

    Abstract

    Understanding the stress behaviour in atomic layer deposited (ALD) thin films enables the optimization of the surface microelectromechanical systems (MEMS) device design. To achieve stress control, we need to characterize how different factors influence the stress in ALD thin films. Stress in ALD aluminium oxide (Al2O3) and titanium dioxide (TiO2) thin films were studied on 150 mm silicon (100) wafers as a function of deposition temperature and layer thickness. Deposition temperature was varied from 110 to 300 °C and layer thickness was varied from 10 to 600 nm. Deposition reactor was Picosun SUNALETM R-150 with water (H2O) based processes. Precursors in use were trimethylaluminum (Me3Al) for Al2O3 and titanium tetrachloride (TiCl4) for TiO2. Stresses in ALD thin films were determined using surface profilometer Veeco Dektak and wafer curvature method. Stresses were calculated using Stoney s equation. Composition was determined with time-of-flight elastic recoil detection analysis (TOF-ERDA) and thickness and density with X-ray reflectivity (XRR). All ALD thin films were measured to be under tensile stress. The stress levels of Al2O3 decreased with increasing deposition temperature. When the influence of the layer thickness was studied with Al2O3 in constant temperature, 300°C, the stress levels increased slightly with decreasing film thickness. Stress adjustment by temperature and thickness seems to be more complicated with TiO2, where the crystallization influences the stress level.
    Original languageEnglish
    Title of host publicationTechnical Program and Abstracts
    PublisherAmerican Vacuum Society AVS
    Publication statusPublished - 2012
    Event12th International Conference on Atomic Layer Deposition, ALD 2012 - Dresden, Germany
    Duration: 17 Jun 201220 Jun 2012
    Conference number: 12

    Conference

    Conference12th International Conference on Atomic Layer Deposition, ALD 2012
    Abbreviated titleALD 2012
    CountryGermany
    CityDresden
    Period17/06/1220/06/12

    Keywords

    • atomic layer deposition
    • ALD
    • aluminum oxide
    • titanium dioxide
    • residual stress

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  • Cite this

    Ylivaara, O., Puurunen, R. L., Laitinen, M., Sintonen, S., Ali, S., Sajavaara, T., Lipsanen, H., & Kiihamäki, J. (2012). Stress in atomic layer deposited aluminium oxide and titanium dioxide thin films. In Technical Program and Abstracts American Vacuum Society AVS.