Sub-THz micromachined waveguides for wafer level integration of MMICs

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    Original languageEnglish
    Title of host publication2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages321-324
    Number of pages4
    ISBN (Electronic)978-2-8748-7048-4
    DOIs
    Publication statusPublished - 19 Dec 2017
    MoE publication typeA4 Article in a conference publication
    Event12th European Microwave Integrated Circuits Conference, EuMIC 2017 - Nuremburg, Germany
    Duration: 9 Oct 201712 Oct 2017

    Conference

    Conference12th European Microwave Integrated Circuits Conference, EuMIC 2017
    CountryGermany
    CityNuremburg
    Period9/10/1712/10/17

    Fingerprint

    Monolithic microwave integrated circuits
    Waveguides
    Waveguide filters
    Silicon
    Silicon wafers
    MEMS
    Communication
    Substrates
    Costs

    Cite this

    Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017 (pp. 321-324). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.23919/EuMIC.2017.8230723
    Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko ; Saarilahti, Jaakko ; Ermolov, Vladimir. / Sub-THz micromachined waveguides for wafer level integration of MMICs. 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers , 2017. pp. 321-324
    @inproceedings{0a5b2f7c69e549ce859f260096a13e99,
    title = "Sub-THz micromachined waveguides for wafer level integration of MMICs",
    abstract = "We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.",
    author = "Pekka Pursula and Antti Lamminen and Mikko Kantanen and Jaakko Saarilahti and Vladimir Ermolov",
    year = "2017",
    month = "12",
    day = "19",
    doi = "10.23919/EuMIC.2017.8230723",
    language = "English",
    pages = "321--324",
    booktitle = "2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017",
    publisher = "IEEE Institute of Electrical and Electronic Engineers",
    address = "United States",

    }

    Pursula, P, Lamminen, A, Kantanen, M, Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers , pp. 321-324, 12th European Microwave Integrated Circuits Conference, EuMIC 2017, Nuremburg, Germany, 9/10/17. https://doi.org/10.23919/EuMIC.2017.8230723

    Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka; Lamminen, Antti; Kantanen, Mikko; Saarilahti, Jaakko; Ermolov, Vladimir.

    2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers , 2017. p. 321-324.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

    T1 - Sub-THz micromachined waveguides for wafer level integration of MMICs

    AU - Pursula, Pekka

    AU - Lamminen, Antti

    AU - Kantanen, Mikko

    AU - Saarilahti, Jaakko

    AU - Ermolov, Vladimir

    PY - 2017/12/19

    Y1 - 2017/12/19

    N2 - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    AB - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    UR - http://www.scopus.com/inward/record.url?scp=85045907879&partnerID=8YFLogxK

    U2 - 10.23919/EuMIC.2017.8230723

    DO - 10.23919/EuMIC.2017.8230723

    M3 - Conference article in proceedings

    AN - SCOPUS:85045907879

    SP - 321

    EP - 324

    BT - 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017

    PB - IEEE Institute of Electrical and Electronic Engineers

    ER -

    Pursula P, Lamminen A, Kantanen M, Saarilahti J, Ermolov V. Sub-THz micromachined waveguides for wafer level integration of MMICs. In 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers . 2017. p. 321-324 https://doi.org/10.23919/EuMIC.2017.8230723