Sub-THz micromachined waveguides for wafer level integration of MMICs

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    Abstract

    We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    Original languageEnglish
    Title of host publication2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages321-324
    Number of pages4
    ISBN (Electronic)978-2-8748-7048-4
    DOIs
    Publication statusPublished - 19 Dec 2017
    MoE publication typeA4 Article in a conference publication
    Event12th European Microwave Integrated Circuits Conference, EuMIC 2017 - Nuremburg, Germany
    Duration: 9 Oct 201712 Oct 2017

    Conference

    Conference12th European Microwave Integrated Circuits Conference, EuMIC 2017
    CountryGermany
    CityNuremburg
    Period9/10/1712/10/17

    Keywords

    • OtaNano

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  • Cite this

    Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017 (pp. 321-324). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.23919/EuMIC.2017.8230723