Sub-THz micromachined waveguides for wafer level integration of MMICs

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

Original languageEnglish
Title of host publication2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages321-324
Number of pages4
ISBN (Electronic)978-2-8748-7048-4
DOIs
Publication statusPublished - 19 Dec 2017
MoE publication typeA4 Article in a conference publication
Event12th European Microwave Integrated Circuits Conference, EuMIC 2017 - Nuremburg, Germany
Duration: 9 Oct 201712 Oct 2017

Conference

Conference12th European Microwave Integrated Circuits Conference, EuMIC 2017
CountryGermany
CityNuremburg
Period9/10/1712/10/17

Fingerprint

Monolithic microwave integrated circuits
Waveguides
Waveguide filters
Silicon
Silicon wafers
MEMS
Communication
Substrates
Costs

Cite this

Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017 (pp. 321-324). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.23919/EuMIC.2017.8230723
Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko ; Saarilahti, Jaakko ; Ermolov, Vladimir. / Sub-THz micromachined waveguides for wafer level integration of MMICs. 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. Institute of Electrical and Electronic Engineers IEEE, 2017. pp. 321-324
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Pursula, P, Lamminen, A, Kantanen, M, Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. Institute of Electrical and Electronic Engineers IEEE, pp. 321-324, 12th European Microwave Integrated Circuits Conference, EuMIC 2017, Nuremburg, Germany, 9/10/17. https://doi.org/10.23919/EuMIC.2017.8230723

Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka; Lamminen, Antti; Kantanen, Mikko; Saarilahti, Jaakko; Ermolov, Vladimir.

2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. Institute of Electrical and Electronic Engineers IEEE, 2017. p. 321-324.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Pursula P, Lamminen A, Kantanen M, Saarilahti J, Ermolov V. Sub-THz micromachined waveguides for wafer level integration of MMICs. In 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. Institute of Electrical and Electronic Engineers IEEE. 2017. p. 321-324 https://doi.org/10.23919/EuMIC.2017.8230723