Abstract
We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
Original language | English |
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Title of host publication | 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 321-324 |
ISBN (Electronic) | 978-2-8748-7048-4 |
ISBN (Print) | 978-1-5386-3966-5 |
DOIs | |
Publication status | Published - 19 Dec 2017 |
MoE publication type | A4 Article in a conference publication |
Event | 12th European Microwave Integrated Circuits Conference, EuMIC 2017 - Nuremburg, Germany Duration: 9 Oct 2017 → 12 Oct 2017 |
Conference
Conference | 12th European Microwave Integrated Circuits Conference, EuMIC 2017 |
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Country/Territory | Germany |
City | Nuremburg |
Period | 9/10/17 → 12/10/17 |
Keywords
- OtaNano