Sub-THz micromachined waveguides for wafer level integration of MMICs

Pekka Pursula; Antti Lamminen; Mikko Kantanen; Jaakko Saarilahti; Vladimir Ermolov

doi:10.23919/EuMIC.2017.8230723

Sub-THz micromachined waveguides for wafer level integration of MMICs

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

Original language	English
Title of host publication	2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	321-324
ISBN (Electronic)	978-2-8748-7048-4
ISBN (Print)	978-1-5386-3966-5
DOIs	https://doi.org/10.23919/EuMIC.2017.8230723
Publication status	Published - 19 Dec 2017
MoE publication type	A4 Article in a conference publication
Event	12th European Microwave Integrated Circuits Conference, EuMIC 2017 - Nuremburg, Germany Duration: 9 Oct 2017 → 12 Oct 2017

Conference

Conference	12th European Microwave Integrated Circuits Conference, EuMIC 2017
Country/Territory	Germany
City	Nuremburg
Period	9/10/17 → 12/10/17

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

OtaNano

Access to Document

10.23919/EuMIC.2017.8230723

Cite this

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title = "Sub-THz micromachined waveguides for wafer level integration of MMICs",

abstract = "We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.",

keywords = "OtaNano",

author = "Pekka Pursula and Antti Lamminen and Mikko Kantanen and Jaakko Saarilahti and Vladimir Ermolov",

year = "2017",

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doi = "10.23919/EuMIC.2017.8230723",

language = "English",

isbn = "978-1-5386-3966-5",

pages = "321--324",

booktitle = "2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "12th European Microwave Integrated Circuits Conference, EuMIC 2017 ; Conference date: 09-10-2017 Through 12-10-2017",

}

Pursula, P , Lamminen, A , Kantanen, M, Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers, pp. 321-324, 12th European Microwave Integrated Circuits Conference, EuMIC 2017, Nuremburg, Germany, 9/10/17. https://doi.org/10.23919/EuMIC.2017.8230723

Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko et al.
2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017. IEEE Institute of Electrical and Electronic Engineers, 2017. p. 321-324.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Sub-THz micromachined waveguides for wafer level integration of MMICs

AU - Pursula, Pekka

AU - Lamminen, Antti

AU - Kantanen, Mikko

AU - Saarilahti, Jaakko

AU - Ermolov, Vladimir

PY - 2017/12/19

Y1 - 2017/12/19

N2 - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

AB - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

KW - OtaNano

UR - https://www.scopus.com/pages/publications/85045907879

U2 - 10.23919/EuMIC.2017.8230723

DO - 10.23919/EuMIC.2017.8230723

M3 - Conference article in proceedings

AN - SCOPUS:85045907879

SN - 978-1-5386-3966-5

SP - 321

EP - 324

BT - 2017 12th European Microwave Integrated Circuits Conference, EuMIC 2017

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 12th European Microwave Integrated Circuits Conference, EuMIC 2017

Y2 - 9 October 2017 through 12 October 2017

ER -

Sub-THz micromachined waveguides for wafer level integration of MMICs

Abstract

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Sub-THz micromachined waveguides for wafer level integration of MMICs

Abstract

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UN SDGs

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