Sub-THz micromachined waveguides for wafer level integration of MMICs

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    3 Citations (Scopus)


    We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
    Original languageEnglish
    Title of host publicationProceedings of the 47th European Microwave Conference (EuMC)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Number of pages4
    ISBN (Electronic)978-2-87487-047-7
    ISBN (Print) 978-1-5386-3964-1
    Publication statusPublished - 19 Dec 2017
    MoE publication typeNot Eligible
    Event47th European Microwave Conference - Nuremberg, Germany
    Duration: 10 Oct 201712 Oct 2017


    Conference47th European Microwave Conference
    Abbreviated titleEuMC


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