We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
|Title of host publication||Proceedings of the 47th European Microwave Conference (EuMC)|
|Publisher||IEEE Institute of Electrical and Electronic Engineers|
|Number of pages||4|
|Publication status||Published - 19 Dec 2017|
|MoE publication type||Not Eligible|
|Event||47th European Microwave Conference - Nuremberg, Germany|
Duration: 10 Oct 2017 → 12 Oct 2017
|Conference||47th European Microwave Conference|
|Period||10/10/17 → 12/10/17|
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2017 EuMC Microwave Prize
Pursula, Pekka (Recipient), Lamminen, Antti (Recipient), Kantanen, Mikko (Recipient), Saarilahti, Jaakko (Recipient) & Ermolov, Vladimir (Recipient), 12 Oct 2017
Prize: Prize for a work