Sub-THz micromachined waveguides for wafer level integration of MMICs

Pekka Pursula; Antti Lamminen; Mikko Kantanen; Jaakko Saarilahti; Vladimir Ermolov

doi:10.23919/eumc.2017.8231029

Sub-THz micromachined waveguides for wafer level integration of MMICs

Pekka Pursula, Antti Lamminen, Mikko Kantanen, Jaakko Saarilahti, Vladimir Ermolov

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Abstract

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

Original language	English
Title of host publication	Proceedings of the 47th European Microwave Conference (EuMC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1061-1064
Number of pages	4
ISBN (Electronic)	978-2-87487-047-7
ISBN (Print)	978-1-5386-3964-1
DOIs	https://doi.org/10.23919/eumc.2017.8231029
Publication status	Published - 19 Dec 2017
MoE publication type	Not Eligible
Event	47th European Microwave Conference - Nuremberg, Germany Duration: 10 Oct 2017 → 12 Oct 2017

Conference

Conference	47th European Microwave Conference
Abbreviated title	EuMC
Country/Territory	Germany
City	Nuremberg
Period	10/10/17 → 12/10/17

Keywords

OtaNano

Access to Document

10.23919/eumc.2017.8231029

Cite this

@inproceedings{7721d1ee1fbb477da988189aa9a5c07d,

title = "Sub-THz micromachined waveguides for wafer level integration of MMICs",

abstract = "We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.",

keywords = "OtaNano",

author = "Pekka Pursula and Antti Lamminen and Mikko Kantanen and Jaakko Saarilahti and Vladimir Ermolov",

year = "2017",

month = dec,

day = "19",

doi = "10.23919/eumc.2017.8231029",

language = "English",

isbn = " 978-1-5386-3964-1",

pages = "1061--1064",

booktitle = "Proceedings of the 47th European Microwave Conference (EuMC)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "47th European Microwave Conference, EuMC ; Conference date: 10-10-2017 Through 12-10-2017",

}

Pursula, P , Lamminen, A , Kantanen, M , Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers, pp. 1061-1064, 47th European Microwave Conference, Nuremberg, Germany, 10/10/17. https://doi.org/10.23919/eumc.2017.8231029

Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko et al.

Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers, 2017. p. 1061-1064.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Sub-THz micromachined waveguides for wafer level integration of MMICs

AU - Pursula, Pekka

AU - Lamminen, Antti

AU - Kantanen, Mikko

AU - Saarilahti, Jaakko

AU - Ermolov, Vladimir

PY - 2017/12/19

Y1 - 2017/12/19

N2 - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

AB - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

KW - OtaNano

UR - http://www.scopus.com/inward/record.url?scp=85046547380&partnerID=8YFLogxK

U2 - 10.23919/eumc.2017.8231029

DO - 10.23919/eumc.2017.8231029

M3 - Conference article in proceedings

SN - 978-1-5386-3964-1

SP - 1061

EP - 1064

BT - Proceedings of the 47th European Microwave Conference (EuMC)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 47th European Microwave Conference

Y2 - 10 October 2017 through 12 October 2017

ER -

Sub-THz micromachined waveguides for wafer level integration of MMICs

Abstract

Conference

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2017 EuMC Microwave Prize

Cite this

Sub-THz micromachined waveguides for wafer level integration of MMICs

Abstract

Conference

Keywords

Access to Document

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Fingerprint

Equipment

OtaNano

Prizes

2017 EuMC Microwave Prize

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