Sub-THz micromachined waveguides for wafer level integration of MMICs

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
    Original languageEnglish
    Title of host publicationProceedings of the 47th European Microwave Conference (EuMC)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1061-1064
    Number of pages4
    ISBN (Electronic)978-2-87487-047-7
    ISBN (Print) 978-1-5386-3964-1
    DOIs
    Publication statusPublished - 19 Dec 2017
    MoE publication typeNot Eligible
    Event47th European Microwave Conference - Nuremberg, Germany
    Duration: 10 Oct 201712 Oct 2017

    Conference

    Conference47th European Microwave Conference
    Abbreviated titleEuMC
    CountryGermany
    CityNuremberg
    Period10/10/1712/10/17

    Fingerprint

    Monolithic microwave integrated circuits
    Waveguides
    Waveguide filters
    Silicon wafers
    MEMS
    Silicon
    Communication
    Substrates
    Costs

    Cite this

    Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In Proceedings of the 47th European Microwave Conference (EuMC) (pp. 1061-1064). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.23919/eumc.2017.8231029
    Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko ; Saarilahti, Jaakko ; Ermolov, Vladimir. / Sub-THz micromachined waveguides for wafer level integration of MMICs. Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers , 2017. pp. 1061-1064
    @inproceedings{7721d1ee1fbb477da988189aa9a5c07d,
    title = "Sub-THz micromachined waveguides for wafer level integration of MMICs",
    abstract = "We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.",
    author = "Pekka Pursula and Antti Lamminen and Mikko Kantanen and Jaakko Saarilahti and Vladimir Ermolov",
    year = "2017",
    month = "12",
    day = "19",
    doi = "10.23919/eumc.2017.8231029",
    language = "English",
    isbn = "978-1-5386-3964-1",
    pages = "1061--1064",
    booktitle = "Proceedings of the 47th European Microwave Conference (EuMC)",
    publisher = "IEEE Institute of Electrical and Electronic Engineers",
    address = "United States",

    }

    Pursula, P, Lamminen, A, Kantanen, M, Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers , pp. 1061-1064, 47th European Microwave Conference, Nuremberg, Germany, 10/10/17. https://doi.org/10.23919/eumc.2017.8231029

    Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka; Lamminen, Antti; Kantanen, Mikko; Saarilahti, Jaakko; Ermolov, Vladimir.

    Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers , 2017. p. 1061-1064.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

    T1 - Sub-THz micromachined waveguides for wafer level integration of MMICs

    AU - Pursula, Pekka

    AU - Lamminen, Antti

    AU - Kantanen, Mikko

    AU - Saarilahti, Jaakko

    AU - Ermolov, Vladimir

    PY - 2017/12/19

    Y1 - 2017/12/19

    N2 - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    AB - We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

    UR - http://www.scopus.com/inward/record.url?scp=85046547380&partnerID=8YFLogxK

    U2 - 10.23919/eumc.2017.8231029

    DO - 10.23919/eumc.2017.8231029

    M3 - Conference article in proceedings

    SN - 978-1-5386-3964-1

    SP - 1061

    EP - 1064

    BT - Proceedings of the 47th European Microwave Conference (EuMC)

    PB - IEEE Institute of Electrical and Electronic Engineers

    ER -

    Pursula P, Lamminen A, Kantanen M, Saarilahti J, Ermolov V. Sub-THz micromachined waveguides for wafer level integration of MMICs. In Proceedings of the 47th European Microwave Conference (EuMC). IEEE Institute of Electrical and Electronic Engineers . 2017. p. 1061-1064 https://doi.org/10.23919/eumc.2017.8231029