Sub-THz micromachined waveguides for wafer level integration of MMICs

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
Original languageEnglish
Title of host publicationProceedings of the 47th European Microwave Conference (EuMC)
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages1061-1064
Number of pages4
ISBN (Electronic)978-2-87487-047-7
ISBN (Print) 978-1-5386-3964-1
DOIs
Publication statusPublished - 19 Dec 2017
MoE publication typeNot Eligible
Event47th European Microwave Conference - Nuremberg, Germany
Duration: 10 Oct 201712 Oct 2017

Conference

Conference47th European Microwave Conference
Abbreviated titleEuMC
CountryGermany
CityNuremberg
Period10/10/1712/10/17

Fingerprint

Monolithic microwave integrated circuits
Waveguides
Waveguide filters
Silicon wafers
MEMS
Silicon
Communication
Substrates
Costs

Cite this

Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In Proceedings of the 47th European Microwave Conference (EuMC) (pp. 1061-1064). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.23919/eumc.2017.8231029
Pursula, Pekka ; Lamminen, Antti ; Kantanen, Mikko ; Saarilahti, Jaakko ; Ermolov, Vladimir. / Sub-THz micromachined waveguides for wafer level integration of MMICs. Proceedings of the 47th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE, 2017. pp. 1061-1064
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Pursula, P, Lamminen, A, Kantanen, M, Saarilahti, J & Ermolov, V 2017, Sub-THz micromachined waveguides for wafer level integration of MMICs. in Proceedings of the 47th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE, pp. 1061-1064, 47th European Microwave Conference, Nuremberg, Germany, 10/10/17. https://doi.org/10.23919/eumc.2017.8231029

Sub-THz micromachined waveguides for wafer level integration of MMICs. / Pursula, Pekka; Lamminen, Antti; Kantanen, Mikko; Saarilahti, Jaakko; Ermolov, Vladimir.

Proceedings of the 47th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE, 2017. p. 1061-1064.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Pursula P, Lamminen A, Kantanen M, Saarilahti J, Ermolov V. Sub-THz micromachined waveguides for wafer level integration of MMICs. In Proceedings of the 47th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE. 2017. p. 1061-1064 https://doi.org/10.23919/eumc.2017.8231029