Sub-THz micromachined waveguides for wafer level integration of MMICs

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    2 Citations (Scopus)

    Abstract

    We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
    Original languageEnglish
    Title of host publicationProceedings of the 47th European Microwave Conference (EuMC)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1061-1064
    Number of pages4
    ISBN (Electronic)978-2-87487-047-7
    ISBN (Print) 978-1-5386-3964-1
    DOIs
    Publication statusPublished - 19 Dec 2017
    MoE publication typeNot Eligible
    Event47th European Microwave Conference - Nuremberg, Germany
    Duration: 10 Oct 201712 Oct 2017

    Conference

    Conference47th European Microwave Conference
    Abbreviated titleEuMC
    CountryGermany
    CityNuremberg
    Period10/10/1712/10/17

    Keywords

    • OtaNano

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  • Equipment

  • Prizes

    2017 EuMC Microwave Prize

    Pursula, Pekka (Recipient), Lamminen, Antti (Recipient), Kantanen, Mikko (Recipient), Saarilahti, Jaakko (Recipient) & Ermolov, Vladimir (Recipient), 12 Oct 2017

    Prize

  • Cite this

    Pursula, P., Lamminen, A., Kantanen, M., Saarilahti, J., & Ermolov, V. (2017). Sub-THz micromachined waveguides for wafer level integration of MMICs. In Proceedings of the 47th European Microwave Conference (EuMC) (pp. 1061-1064). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.23919/eumc.2017.8231029