Substrate-facilitated nanoparticle sintering and component interconnection procedure

Research output: Contribution to journalArticleScientificpeer-review

34 Citations (Scopus)

Abstract

Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.
Original languageEnglish
JournalNanotechnology
Volume21
Issue number47
DOIs
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed

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Silver
Sintering
Nanoparticles
Printing
Substrates
Ink
Electric properties
Ligands
Mechanical properties
Temperature

Cite this

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title = "Substrate-facilitated nanoparticle sintering and component interconnection procedure",
abstract = "Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.",
author = "M. Allen and J. Lepp{\"a}niemi and M. Vilkman and A. Alastalo and T. Mattila",
year = "2010",
doi = "10.1088/0957-4484/21/47/475204",
language = "English",
volume = "21",
journal = "Nanotechnology",
issn = "0957-4484",
publisher = "Institute of Physics IOP",
number = "47",

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Substrate-facilitated nanoparticle sintering and component interconnection procedure. / Allen, M.; Leppäniemi, J.; Vilkman, M.; Alastalo, A.; Mattila, T.

In: Nanotechnology, Vol. 21, No. 47, 2010.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Substrate-facilitated nanoparticle sintering and component interconnection procedure

AU - Allen, M.

AU - Leppäniemi, J.

AU - Vilkman, M.

AU - Alastalo, A.

AU - Mattila, T.

PY - 2010

Y1 - 2010

N2 - Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

AB - Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

U2 - 10.1088/0957-4484/21/47/475204

DO - 10.1088/0957-4484/21/47/475204

M3 - Article

VL - 21

JO - Nanotechnology

JF - Nanotechnology

SN - 0957-4484

IS - 47

ER -