Abstract
According to an example aspect of the present invention, there is provided a superconducting device comprising a silicon substrate (101), a superconducting layer (110) directly on a first face (101a) of the silicon substrate (101), the superconducting layer (110) covering a part, but not all, of the first face (101a) of the silicon substrate (101), and a silicon nitride layer (109) directly covering at least one part of the first face (101a) of the silicon substrate (101) which is not covered by the superconducting layer (110).
Patent family as of 14.7.2026
AU2024275160 AA, AU2024275160 BB, CA3293169 AA, EP4706354 A1, FI131716 B, FI20235579 A, WO24240987 A1
Patent family as of 14.7.2026
AU2024275160 AA, AU2024275160 BB, CA3293169 AA, EP4706354 A1, FI131716 B, FI20235579 A, WO24240987 A1
| Original language | English |
|---|---|
| Patent number | FI 131716 B1 |
| IPC | H01L25/065 |
| Priority date | 24/05/23 |
| Filing date | 24/05/23 |
| Publication status | Published - 13 Oct 2025 |
| MoE publication type | H1 Granted patent |
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