Abstract
This paper presents the results of the surface degradation measurements conducted on nanostructured polymer compounds consisting of polypropylene (PP), polyaniline (PANI) and acrylic acid (AA).
According to prior investigations the chosen additives have improved the electrical performance of polypropylene e.g. dielectric breakdown strength and relative permittivity.
Materials were subjected to high voltage stress leading to partial discharges (PD). Surface degradation was measured with optical profilometry. The partial discharge activity during corona bombardment was also measured.
The measurements were conducted at the high voltage laboratory of Tampere University of Technology. Statistical analysis was applied to the results to determine the effects of the additive on the surface degradation and PD activity of polypropylene.
According to prior investigations the chosen additives have improved the electrical performance of polypropylene e.g. dielectric breakdown strength and relative permittivity.
Materials were subjected to high voltage stress leading to partial discharges (PD). Surface degradation was measured with optical profilometry. The partial discharge activity during corona bombardment was also measured.
The measurements were conducted at the high voltage laboratory of Tampere University of Technology. Statistical analysis was applied to the results to determine the effects of the additive on the surface degradation and PD activity of polypropylene.
Original language | English |
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Title of host publication | Proceedings |
Subtitle of host publication | IEEE International Symposium on Electrical Insulation, ISEI 2008 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 205-209 |
ISBN (Print) | 978-1-4244-2091-9, 978-1-4244-2092-6 |
DOIs | |
Publication status | Published - 2008 |
MoE publication type | A4 Article in a conference publication |
Event | International Symposium on Electrical Insulation, ISEI 2008 - Vancouver, BC, Canada Duration: 9 Jun 2008 → 12 Jun 2008 |
Conference
Conference | International Symposium on Electrical Insulation, ISEI 2008 |
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Abbreviated title | ISEI 2008 |
Country/Territory | Canada |
City | Vancouver, BC |
Period | 9/06/08 → 12/06/08 |