Abstract
Trends towards sustainable light-weight packaging
materials not interfering with the end-of-life or
recycling schemes.
Thin film deposition techniques presented as tools for
applying functional layers at the nano-scale on different
surfaces.
Techniques, such as atomic layer deposition, provide
possibilities to enhance the barrier properties of
sensitive materials including papers, polymer films and
coated papers and boards
Original language | English |
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Title of host publication | Specialty Papers Europe 2011 Proceedings |
Publisher | Pira International Ltd |
Publication status | Published - 2011 |
MoE publication type | B3 Non-refereed article in conference proceedings |
Event | Specialty Papers Europe 2011, Frankfurt, 29 November - 1 December 2011 - Duration: 1 Jan 2011 → … |
Conference
Conference | Specialty Papers Europe 2011, Frankfurt, 29 November - 1 December 2011 |
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Period | 1/01/11 → … |
Keywords
- ALD
- atomic layer deposition
- barrier
- packaging material
- sustainable
- thin film