Abstract
Trends towards sustainable light-weight packaging
materials not interfering with the end-of-life or
recycling schemes.
Thin film deposition techniques presented as tools for
applying functional layers at the nano-scale on different
surfaces.
Techniques, such as atomic layer deposition, provide
possibilities to enhance the barrier properties of
sensitive materials including papers, polymer films and
coated papers and boards
| Original language | English |
|---|---|
| Title of host publication | Specialty Papers Europe 2011 Proceedings |
| Publisher | Pira International Ltd |
| Publication status | Published - 2011 |
| MoE publication type | B3 Non-refereed article in conference proceedings |
| Event | Specialty Papers Europe 2011, Frankfurt, 29 November - 1 December 2011 - Duration: 1 Jan 2011 → … |
Conference
| Conference | Specialty Papers Europe 2011, Frankfurt, 29 November - 1 December 2011 |
|---|---|
| Period | 1/01/11 → … |
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Keywords
- ALD
- atomic layer deposition
- barrier
- packaging material
- sustainable
- thin film
Cite this
Vähä-Nissi, M. (2011). Sustainable packaging materials with thin film deposition techniques. In Specialty Papers Europe 2011 Proceedings Pira International Ltd.