Sustainable Passive Temperature and Pressure Sensor for Tire

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper introduces two sustainable tire pressure measurement system (TPMS) solutions based on passive RFID sensor technology. TPMS solutions were built up on thin and flexible bio-PET substrates. Electronic circuitries patterned by copper ink using screen printing process so that first sensor version was fully printed. The copper RFID antenna in the second version was implemented by using transfer film technology providing full metallic antenna structure. In addition, the RFID antenna design was modified and enlarged. Pressure sensor components bonded on both system substrates by SnBiAg solder using low-temperature soldering process having peak temperature of 156°C. Components were supported by UV curable adhesive after bonding process to improve sensor long term reliability. Functional testing of assembled systems performed by placing system into garden pressure bottle together with ContiPressure Check™ pressure sensor applied in trucks and lorries. ContiPressureCheck™ provided reference measurement values during the measurement. Pressure inside the garden pressure bottle increased gradually up to 4 bar pressure in functional testing. Temperature measured at the same time as pressure by applied sensor component. Measured data of both sensor solutions gathered through CAEN RF reader device equipped with Bluetooth®. Specific mobile phone application implemented and applied to gather sensor measurement results from the CAEN RF reader device. Reference sensor measurement data attained by ContiPressureCheck™ terminal provided by Continental. Terminal communicated wirelessly with ContiPressureCheck™ system sensor using Bluetooth®.

Original languageEnglish
Title of host publication2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages5
ISBN (Electronic)979-8-3503-9036-0
ISBN (Print)979-8-3503-9037-7
DOIs
Publication statusPublished - 2024
MoE publication typeA4 Article in a conference publication
Event10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 - Berlin, Germany
Duration: 11 Sept 202413 Sept 2024

Conference

Conference10th IEEE Electronics System-Integration Technology Conference, ESTC 2024
Country/TerritoryGermany
CityBerlin
Period11/09/2413/09/24

Keywords

  • bio-PET substrate
  • copper ink
  • low temperature soldering
  • pressure sensing
  • RFID sensor technology
  • screen printing
  • transfer film

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