Abstract
This paper focuses on evaluation of paper as a substrate for printed flexible electronics. The motivation for using paper as a substrate comes from its attractive recycling and composting properties. In electronics manufacturing the majority of the materials used come from the substrate (>>50%). Thereby, the use of a sustainable substrate is the first step towards sustainable flexible electronics. The next step would be evaluation and development of the other materials required, such as inks and adhesives, for minimal environmental impact. This paper presents results on evaluation of existing commercial printed semiconductor and conductor ink performance on different paper substrate grades. The ultimate goal was to evaluate the potential of semiconductor and conductor materials as part of an NFC powered electrochromic display [1].
| Original language | English |
|---|---|
| Title of host publication | Printing for Fabrication 2019 |
| Subtitle of host publication | Materials, Applications, and Process - Technical Program and Proceedings |
| Publisher | The Society for Imaging Science and Technology, IS&T |
| Pages | 132-137 |
| ISBN (Electronic) | 978-0-89208-341-1 |
| ISBN (Print) | 978-1-71381-350-7 |
| DOIs | |
| Publication status | Published - 2019 |
| MoE publication type | A4 Article in a conference publication |
| Event | 35th International Conference on Digital Printing Technologies, NIP 2019 - San Francisco, United States Duration: 29 Sept 2019 → 3 Oct 2019 |
Publication series
| Series | International Conference on Digital Printing Technologies |
|---|---|
| Volume | 35 |
| ISSN | 2169-4362 |
Conference
| Conference | 35th International Conference on Digital Printing Technologies, NIP 2019 |
|---|---|
| Country/Territory | United States |
| City | San Francisco |
| Period | 29/09/19 → 3/10/19 |
Funding
Research leading to the results presented here has received funding from European Institute of Innovation and Technology (EIT). Partners of SUPERSMART project are acknowledged for their support and co-operation. Part of the facilities used were provided by the Academy of Finland Research Infrastructure “Printed Intelligence Infrastructure” (PII-FIRI, grant no. 32020).
