Sustainable temperature and pressure sensor for tire

Kimmo Keränen, Timo Kurkela, Jyrki Ollila, Marko Korkalainen, Antti Tanskanen, Antoine Balin, Arne Buchholz, Anbarasan Mani

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper introduces two generations of sustainable tire pressure measurement sensor (TPMS) solution. Sensor solutions are built up on thin and flexible bio-PET substrates. Circuitries patterned by copper ink using screen printing process. Assembly of required SMD components including RFID and pressure sensor bonded on substrate using SnBiAg solder in low-temperature soldering process having peak temperature of 156°C. Components were supported by UV curable adhesive after bonding process to improve sensor long term reliability. Functional testing of assembled systems performed by placing system into garden pressure bottle together with Continental pressure sensor applied in trucks and lorries as reference measurement solution. Pressure inside the garden bottle increased gradually up to 4 bar pressure in functional testing. Measured data of sustainable sensors gathered through Bluetootb® using implemented mobile phone application. Reference sensor data monitored wirelessly through reference system by Continental.
Original languageEnglish
Title of host publication2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages4
ISBN (Electronic)979-8-3503-8326-3
ISBN (Print)979-8-3503-8327-0
DOIs
Publication statusPublished - 2024
MoE publication typeA4 Article in a conference publication
Event6th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2024 - Tampere, Finland
Duration: 30 Jun 20243 Jul 2024

Publication series

Series IEEE International Conference on Flexible and Printable Sensors and Systems
Volume2024
ISSN2832-8248

Conference

Conference6th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2024
Country/TerritoryFinland
CityTampere
Period30/06/243/07/24

Keywords

  • biomaterial PET substrate
  • copper ink circuitry
  • low-temperature solder bonding
  • screen printing
  • TPMS

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