System-in-package LTCC platform for 3D RF to millimeter wave

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)


    This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves.
    The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications.
    Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays
    Original languageEnglish
    Title of host publicationProceedings of SPIE
    Subtitle of host publicationNanosensors, Biosensors, and Info-Tech Sensors and Systems
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-0-8194-8542-7
    Publication statusPublished - 2011
    MoE publication typeA4 Article in a conference publication
    EventSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States
    Duration: 11 Mar 201215 Mar 2012

    Publication series

    SeriesProceedings of SPIE


    ConferenceSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
    Country/TerritoryUnited States
    CitySan Diego


    • LTCC
    • microwave
    • millimeter wave
    • module
    • SiP


    Dive into the research topics of 'System-in-package LTCC platform for 3D RF to millimeter wave'. Together they form a unique fingerprint.

    Cite this