System-in-package LTCC platform for 3D RF to millimeter wave

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves.
The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications.
Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays
Original languageEnglish
Title of host publicationProceedings of SPIE
Subtitle of host publicationNanosensors, Biosensors, and Info-Tech Sensors and Systems
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-0-8194-8542-7
DOIs
Publication statusPublished - 2011
MoE publication typeA4 Article in a conference publication
EventSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States
Duration: 11 Mar 201215 Mar 2012

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume7980

Conference

ConferenceSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
CountryUnited States
CitySan Diego
Period11/03/1215/03/12

Fingerprint

Millimeter waves
Metallizing
Antenna arrays
Temperature
Microwaves
Soldering
Monolithic microwave integrated circuits
Metals
System-in-package
Wire
Communication

Keywords

  • LTCC
  • microwave
  • millimeter wave
  • module
  • SiP

Cite this

Vähä-Heikkilä, T., & Lahti, M. (2011). System-in-package LTCC platform for 3D RF to millimeter wave. In Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems [79800W] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 7980 https://doi.org/10.1117/12.880371
Vähä-Heikkilä, Tauno ; Lahti, Markku. / System-in-package LTCC platform for 3D RF to millimeter wave. Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE, 2011. (Proceedings of SPIE, Vol. 7980).
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abstract = "This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays",
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Vähä-Heikkilä, T & Lahti, M 2011, System-in-package LTCC platform for 3D RF to millimeter wave. in Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems ., 79800W, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 7980, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, United States, 11/03/12. https://doi.org/10.1117/12.880371

System-in-package LTCC platform for 3D RF to millimeter wave. / Vähä-Heikkilä, Tauno; Lahti, Markku.

Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE, 2011. 79800W (Proceedings of SPIE, Vol. 7980).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Vähä-Heikkilä T, Lahti M. System-in-package LTCC platform for 3D RF to millimeter wave. In Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE. 2011. 79800W. (Proceedings of SPIE, Vol. 7980). https://doi.org/10.1117/12.880371