System-in-package LTCC platform for 3D RF to millimeter wave

Tauno Vähä-Heikkilä; Markku Lahti

doi:10.1117/12.880371

System-in-package LTCC platform for 3D RF to millimeter wave

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves.
The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications.
Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays

Original language	English
Title of host publication	Proceedings of SPIE
Subtitle of host publication	Nanosensors, Biosensors, and Info-Tech Sensors and Systems
Publisher	International Society for Optics and Photonics SPIE
ISBN (Print)	978-0-8194-8542-7
DOIs	https://doi.org/10.1117/12.880371
Publication status	Published - 2011
MoE publication type	A4 Article in a conference publication
Event	SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States Duration: 11 Mar 2012 → 15 Mar 2012

Publication series

Series	Proceedings of SPIE
Volume	7980

Conference

Conference	SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
Country/Territory	United States
City	San Diego
Period	11/03/12 → 15/03/12

Keywords

LTCC
microwave
millimeter wave
module
SiP

Access to Document

10.1117/12.880371

Cite this

@inproceedings{44936dd46aaa46389150e4e3a45e7bb5,

title = "System-in-package LTCC platform for 3D RF to millimeter wave",

abstract = "This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays",

keywords = "LTCC, microwave, millimeter wave, module, SiP",

author = "Tauno V{\"a}h{\"a}-Heikkil{\"a} and Markku Lahti",

year = "2011",

doi = "10.1117/12.880371",

language = "English",

isbn = "978-0-8194-8542-7",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

booktitle = "Proceedings of SPIE",

address = "United States",

note = "SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring : Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 ; Conference date: 11-03-2012 Through 15-03-2012",

}

Vähä-Heikkilä, T & Lahti, M 2011, System-in-package LTCC platform for 3D RF to millimeter wave. in Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems ., 79800W, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 7980, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, California, United States, 11/03/12. https://doi.org/10.1117/12.880371

System-in-package LTCC platform for 3D RF to millimeter wave. / Vähä-Heikkilä, Tauno ; Lahti, Markku.
Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE, 2011. 79800W (Proceedings of SPIE, Vol. 7980).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Vähä-Heikkilä, Tauno

AU - Lahti, Markku

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N2 - This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays

AB - This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays

KW - LTCC

KW - microwave

KW - millimeter wave

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SN - 978-0-8194-8542-7

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PB - International Society for Optics and Photonics SPIE

T2 - SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring

Y2 - 11 March 2012 through 15 March 2012

ER -

System-in-package LTCC platform for 3D RF to millimeter wave

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Keywords

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