Tantalum carbide and nitride diffusion barriers for Cu metallization
- Tomi Laurila*
- , Kejun Zeng
- , Jorma Kivilahti
- , Jyrki Molarius
- , Tommi Riekkinen
- , Ilkka Suni
*Corresponding author for this work
- Helsinki University of Technology
Research output: Contribution to journal › Article › Scientific › peer-review
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