Original language | English |
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Title of host publication | Elektronische Baugruppen |
Subtitle of host publication | Aufbau- und Fertigungstechnik |
Publisher | VDE Verlag |
Pages | 29-34 |
ISBN (Print) | 3-8007-2813-3 |
Publication status | Published - 2004 |
MoE publication type | A4 Article in a conference publication |
Event | DVS/GMM-Fachtagung - Fellbach, Germany Duration: 4 Feb 2004 → 5 Feb 2004 |
Publication series
Series | GMM-Fachbericht |
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Number | 44 |
ISSN | 1432-3419 |
Conference
Conference | DVS/GMM-Fachtagung |
---|---|
Country | Germany |
City | Fellbach |
Period | 4/02/04 → 5/02/04 |
Cite this
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Technologies for hybrid integration of photonic and electronic micromodules. / Kopola, Harri; Aikio, Janne; Aikio, Mauri; Jaakola, Tuomo; Mäkinen, Jukka-Tapani; Karppinen, Mikko; Hiltunen, Jussi; Kololuoma, Terho.
Elektronische Baugruppen: Aufbau- und Fertigungstechnik. VDE Verlag, 2004. p. 29-34 (GMM-Fachbericht; No. 44).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Technologies for hybrid integration of photonic and electronic micromodules
AU - Kopola, Harri
AU - Aikio, Janne
AU - Aikio, Mauri
AU - Jaakola, Tuomo
AU - Mäkinen, Jukka-Tapani
AU - Karppinen, Mikko
AU - Hiltunen, Jussi
AU - Kololuoma, Terho
PY - 2004
Y1 - 2004
M3 - Conference article in proceedings
SN - 3-8007-2813-3
T3 - GMM-Fachbericht
SP - 29
EP - 34
BT - Elektronische Baugruppen
PB - VDE Verlag
ER -