Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator

M. Koskenvuori; Ville Kaajakari; Tomi Mattila; I. Tittonen

doi:10.1109/MEMSYS.2008.4443597

Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator

M. Koskenvuori, Ville Kaajakari, Tomi Mattila, I. Tittonen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

23 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	78-81
ISBN (Print)	978-1-4244-1792-6, 978-1-4244-1793-3
DOIs	https://doi.org/10.1109/MEMSYS.2008.4443597
Publication status	Published - 2008
MoE publication type	A4 Article in a conference publication
Event	IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008 - Wuhan, China Duration: 13 Jan 2008 → 17 Jan 2008

Conference

Conference	IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008
Abbreviated title	MEMSYS 2008
Country/Territory	China
City	Wuhan
Period	13/01/08 → 17/01/08

Access to Document

10.1109/MEMSYS.2008.4443597

Cite this

Koskenvuori, M., Kaajakari, V., Mattila, T., & Tittonen, I. (2008). Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator. In Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008 (pp. 78-81). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/MEMSYS.2008.4443597

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title = "Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator",

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doi = "10.1109/MEMSYS.2008.4443597",

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booktitle = "Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008",

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note = "IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008, MEMSYS 2008 ; Conference date: 13-01-2008 Through 17-01-2008",

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Koskenvuori, M, Kaajakari, V, Mattila, T & Tittonen, I 2008, Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator. in Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008. IEEE Institute of Electrical and Electronic Engineers, pp. 78-81, IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008, Wuhan, China, 13/01/08. https://doi.org/10.1109/MEMSYS.2008.4443597

Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator. / Koskenvuori, M.; Kaajakari, Ville; Mattila, Tomi et al.
Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008. IEEE Institute of Electrical and Electronic Engineers, 2008. p. 78-81.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T1 - Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator

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AU - Kaajakari, Ville

AU - Mattila, Tomi

AU - Tittonen, I.

PY - 2008

Y1 - 2008

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DO - 10.1109/MEMSYS.2008.4443597

M3 - Conference article in proceedings

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SN - 978-1-4244-1793-3

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EP - 81

BT - Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008

Y2 - 13 January 2008 through 17 January 2008

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Koskenvuori M, Kaajakari V, Mattila T, Tittonen I. Temperature measurement and compensation based on two vibrating modes of a bulk acoustic mode microresonator. In Proceedings of the IEEE 21st International Conference on Micro Electro Mechanical Systems, MEMSYS 2008. IEEE Institute of Electrical and Electronic Engineers. 2008. p. 78-81 doi: 10.1109/MEMSYS.2008.4443597