Temperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integration

Kristina Bespalova, Glenn Ross, Mervi Paulasto-Kröckel, T.S. Abhilash, Cyril Karuthedath, Stefan Mertin, Tuomas Pensala

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

In this study, Al 0.8 Sc 0.2 N multilayer structures phase stability, interfacial quality, and piezoelectric response were tested before and after annealing in wide range of temperatures and times. The thicknesses and sequence of the layers in the structures are a replica of the design used for the fabrication of piezoelectric micromachined ultrasonic transducers (pMUTs). Al, AlSi (1%), Al/Mo, and Mo have been assessed to choose the most reliable top electrode (TE) material for the structures. The piezoresponse of the structure was estimated by measuring the deflection of piezocantilevers as a function of voltage applied over the film. Membrane deflection at resonance frequency for AlScN- and AlN-based pMUTs was simulated in COMSOL Multiphysics. It is found that the structure with Mo TE layer is stable after annealing at 800°C for 300 h and at 1000 °C for 100 h. None of the structures formed any phases at the interface between the electrode layer and AlScN. Membrane deflection for structures with AlScN as piezolayer is almost three times higher as compared to structures with AlN as piezolayer. Moreover, the pMUT membrane deflection increases after annealing of the structure.
Original languageEnglish
Title of host publication2020 IEEE International Ultrasonics Symposium (IUS)
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages4
ISBN (Electronic)978-1-7281-5448-0
ISBN (Print)978-1-7281-5449-7
DOIs
Publication statusPublished - 7 Sep 2020
MoE publication typeA4 Article in a conference publication
EventIEEE International Ultrasonics Symposium, IUS - Las Vegas, United States
Duration: 7 Sep 202011 Sep 2020

Publication series

SeriesIEEE International Ultrasonics Symposium
ISSN1948-5727

Conference

ConferenceIEEE International Ultrasonics Symposium, IUS
Country/TerritoryUnited States
CityLas Vegas
Period7/09/2011/09/20

Keywords

  • Aluminium Scandium Nitride
  • pMUT
  • thin-film deposition
  • annealing

Fingerprint

Dive into the research topics of 'Temperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integration'. Together they form a unique fingerprint.

Cite this