Abstract
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS
Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are
presented. Measurements include charge collection, tracking efficiency
and charge sharing between pixel cells, as a function of track incident
angle, and were performed with and without a 1.6 T magnetic field
oriented as the ATLAS inner detector solenoid field. Sensors were
bump-bonded to the front-end chip currently used in the ATLAS pixel
detector. Full 3D sensors, with electrodes penetrating through the
entire wafer thickness and active edge, and double-sided 3D sensors with
partially overlapping bias and read-out electrodes were tested and
showed comparable performance.
| Original language | English |
|---|---|
| Pages (from-to) | 33-40 |
| Number of pages | 8 |
| Journal | Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
| Volume | 638 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 11 May 2011 |
| MoE publication type | Not Eligible |
Keywords
- 3D sensors
- ATLAS upgrade
- Radiation hard detectors
- Silicon sensors
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