Test chip and process design for evaluating flip chip technology

Jaakko Salonen, Jorma Salmi

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationFirst International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium
    Place of PublicationNeffs
    Pages230-233
    Publication statusPublished - 1994
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event1st International Symposium on Flip Chip Technology - San Jose, United States
    Duration: 15 Feb 199417 Feb 1994

    Conference

    Conference1st International Symposium on Flip Chip Technology
    CountryUnited States
    CitySan Jose
    Period15/02/9417/02/94

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