Test chip and process design for evaluating flip chip technology

Jaakko Salonen, Jorma Salmi

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationFirst International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium
Place of PublicationNeffs
Pages230-233
Publication statusPublished - 1994
MoE publication typeB3 Non-refereed article in conference proceedings
Event1st International Symposium on Flip Chip Technology - San Jose, United States
Duration: 15 Feb 199417 Feb 1994

Conference

Conference1st International Symposium on Flip Chip Technology
CountryUnited States
CitySan Jose
Period15/02/9417/02/94

Cite this

Salonen, J., & Salmi, J. (1994). Test chip and process design for evaluating flip chip technology. In First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium (pp. 230-233).