| Original language | English |
|---|---|
| Title of host publication | First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium |
| Place of Publication | Neffs |
| Pages | 230-233 |
| Publication status | Published - 1994 |
| MoE publication type | B3 Non-refereed article in conference proceedings |
| Event | 1st International Symposium on Flip Chip Technology - San Jose, United States Duration: 15 Feb 1994 → 17 Feb 1994 |
Conference
| Conference | 1st International Symposium on Flip Chip Technology |
|---|---|
| Country | United States |
| City | San Jose |
| Period | 15/02/94 → 17/02/94 |
Cite this
Salonen, J., & Salmi, J. (1994). Test chip and process design for evaluating flip chip technology. In First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium (pp. 230-233).