Test chip and process design for evaluating flip chip technology

Jaakko Salonen; Jorma Salmi

Test chip and process design for evaluating flip chip technology

Jaakko Salonen, Jorma Salmi

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium
Place of Publication	Neffs
Pages	230-233
Publication status	Published - 1994
MoE publication type	B3 Non-refereed article in conference proceedings
Event	1st International Symposium on Flip Chip Technology - San Jose, United States Duration: 15 Feb 1994 → 17 Feb 1994

Conference

Conference	1st International Symposium on Flip Chip Technology
Country/Territory	United States
City	San Jose
Period	15/02/94 → 17/02/94

Cite this

@inproceedings{d47b5b01c689465aa3c2d31b24cd5ae8,

title = "Test chip and process design for evaluating flip chip technology",

author = "Jaakko Salonen and Jorma Salmi",

year = "1994",

language = "English",

pages = "230--233",

booktitle = "First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium",

note = "1st International Symposium on Flip Chip Technology ; Conference date: 15-02-1994 Through 17-02-1994",

}

Test chip and process design for evaluating flip chip technology. / Salonen, Jaakko; Salmi, Jorma.
First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium. Neffs, 1994. p. 230-233.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Test chip and process design for evaluating flip chip technology

AU - Salonen, Jaakko

AU - Salmi, Jorma

PY - 1994

Y1 - 1994

M3 - Conference article in proceedings

SP - 230

EP - 233

BT - First International Symposium on Flip Chip Technology, held in conjunction with the Sixth International TAB/Advanced Packaging Symposium

CY - Neffs

T2 - 1st International Symposium on Flip Chip Technology

Y2 - 15 February 1994 through 17 February 1994

ER -