Abstract
| Original language | English |
|---|---|
| Title of host publication | 2013 IEEE International 3D Systems Integration Conference (3DIC) |
| Publisher | Institute of Electrical and Electronic Engineers IEEE |
| ISBN (Print) | 978-1-4673-6484-3 |
| DOIs | |
| Publication status | Published - 2013 |
| MoE publication type | A4 Article in a conference publication |
| Event | IEEE International 3D Systems Integration Conference, 3DIC 2013 - San Francisco, United States Duration: 2 Oct 2013 → 4 Oct 2013 |
Conference
| Conference | IEEE International 3D Systems Integration Conference, 3DIC 2013 |
|---|---|
| Abbreviated title | 3DIC 2013 |
| Country | United States |
| City | San Francisco |
| Period | 2/10/13 → 4/10/13 |
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Keywords
- 3D IPD
- 3D Mechnical Stress
- Cu plating
- HAR TSV
- MEMS Manufacturing
- Q-value
- Reliablity
- RF Losses
- RF TSV
- Signal and Power Integrity
- Thermal Characterization
- Toroidal Inductors
Cite this
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The development and evaluation of RF TSV for 3D IPD applications. / Ebefors, Thorbjörn; Fredlund, Jessica; Perttu, Daniel; van Dijk, Raymond; Cifola, Lorenzo; Kaunisto, Mikko; Rantakari, Pekka; Vähä-Heikkilä, Tauno.
2013 IEEE International 3D Systems Integration Conference (3DIC). Institute of Electrical and Electronic Engineers IEEE, 2013. Article number 6702382.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - The development and evaluation of RF TSV for 3D IPD applications
AU - Ebefors, Thorbjörn
AU - Fredlund, Jessica
AU - Perttu, Daniel
AU - van Dijk, Raymond
AU - Cifola, Lorenzo
AU - Kaunisto, Mikko
AU - Rantakari, Pekka
AU - Vähä-Heikkilä, Tauno
N1 - CA2: TK609 SDA: ICT
PY - 2013
Y1 - 2013
N2 - In this paper, Silex Microsystems, the world's largest Pure-Play MEMS foundry, together with partners TNO and VTT, present our recent advancements in RF through silicon Vias (TSV) for 3D integrated passive devices (IPD) applications, achieved in conjunction with the European consortium EPAMO. A novel open TSV fabrication process on 200 mm diameter 305 µm thick High Resistivity wafers has been used to demonstrated High Aspect Ratio Through Silicon Vias (HAR TSV), focusing on tight pitch, resulting in 36 TSV/mm2 Via density. 305 µm wafer thickness enables the fabrication of rigid interposers, an advancement in the commercialization of 3D packaging technology. The fabrication includes double sided deep reactive ion etching (DRIE), developments and evaluation on various conformal high aspect ratio (HAR) plating seedlayer processes, and void-free TSV Cu plating of open rigid TSV structures and bonding to glass wafers for characterization. The electrical characterization of the fabricated devices was performed by VTT with excellent measured RF properties: in specific, low RF losses as well as low DC resistances of less than 20 mOhm/TSV. Several different coplanar waveguide (CPW) test vehicles and other RF TSV test structures together with Daisy Chain and parasitic Capacitance test structures were designed, fabricated and evaluated. The loss of a single coplanar TSV transition is less than 0.04 dB @ 5 GHz, which is considered to be very small. The developed TSV technology was also employed to fabricate 3D toroidal inductors. These inductors were characterized by TNO showing high Q-factor (>30) and self-resonance frequency (> 6 GHz) for 3D inductors in the range of 1-15 nH. 1 and 2 port inductor temperature characteristics over temperature interval from room temperature to 111°C are reported. A fabrication integration scheme for fully integrated RF-IPD with 3D TSV based inductors and high ohmic polysilicon (p-Si) resistors and piezoelectric (PZT) metal-insulator-metal (MIM) capacitors are discussed. Outlook for improvements using integrated high frequency magnetic flux materials and commercialization aspects are described
AB - In this paper, Silex Microsystems, the world's largest Pure-Play MEMS foundry, together with partners TNO and VTT, present our recent advancements in RF through silicon Vias (TSV) for 3D integrated passive devices (IPD) applications, achieved in conjunction with the European consortium EPAMO. A novel open TSV fabrication process on 200 mm diameter 305 µm thick High Resistivity wafers has been used to demonstrated High Aspect Ratio Through Silicon Vias (HAR TSV), focusing on tight pitch, resulting in 36 TSV/mm2 Via density. 305 µm wafer thickness enables the fabrication of rigid interposers, an advancement in the commercialization of 3D packaging technology. The fabrication includes double sided deep reactive ion etching (DRIE), developments and evaluation on various conformal high aspect ratio (HAR) plating seedlayer processes, and void-free TSV Cu plating of open rigid TSV structures and bonding to glass wafers for characterization. The electrical characterization of the fabricated devices was performed by VTT with excellent measured RF properties: in specific, low RF losses as well as low DC resistances of less than 20 mOhm/TSV. Several different coplanar waveguide (CPW) test vehicles and other RF TSV test structures together with Daisy Chain and parasitic Capacitance test structures were designed, fabricated and evaluated. The loss of a single coplanar TSV transition is less than 0.04 dB @ 5 GHz, which is considered to be very small. The developed TSV technology was also employed to fabricate 3D toroidal inductors. These inductors were characterized by TNO showing high Q-factor (>30) and self-resonance frequency (> 6 GHz) for 3D inductors in the range of 1-15 nH. 1 and 2 port inductor temperature characteristics over temperature interval from room temperature to 111°C are reported. A fabrication integration scheme for fully integrated RF-IPD with 3D TSV based inductors and high ohmic polysilicon (p-Si) resistors and piezoelectric (PZT) metal-insulator-metal (MIM) capacitors are discussed. Outlook for improvements using integrated high frequency magnetic flux materials and commercialization aspects are described
KW - 3D IPD
KW - 3D Mechnical Stress
KW - Cu plating
KW - HAR TSV
KW - MEMS Manufacturing
KW - Q-value
KW - Reliablity
KW - RF Losses
KW - RF TSV
KW - Signal and Power Integrity
KW - Thermal Characterization
KW - Toroidal Inductors
U2 - 10.1109/3DIC.2013.6702382
DO - 10.1109/3DIC.2013.6702382
M3 - Conference article in proceedings
SN - 978-1-4673-6484-3
BT - 2013 IEEE International 3D Systems Integration Conference (3DIC)
PB - Institute of Electrical and Electronic Engineers IEEE
ER -