The effect of moisture on die attach joints made with silver filled epoxy

Outi Rusanen, Jaakko Lenkkeri, Liisa Kivimäki

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	25-27
Journal	Microelectronics International
Volume	12
Issue number	2
DOIs	https://doi.org/10.1108/eb044561
Publication status	Published - 1995
MoE publication type	A1 Journal article-refereed

Access to Document

@article{c0c9818db04846d29def8e679ef0947f,

title = "The effect of moisture on die attach joints made with silver filled epoxy",

author = "Outi Rusanen and Jaakko Lenkkeri and Liisa Kivim{\"a}ki",

year = "1995",

doi = "10.1108/eb044561",

language = "English",

volume = "12",

pages = "25--27",

journal = "Microelectronics International",

issn = "1356-5362",

publisher = "Emerald Publishing Limited",

number = "2",

}