The effect of moisture on die attach joints made with silver filled epoxy

Outi Rusanen, Jaakko Lenkkeri, Liisa Kivimäki

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)25-27
JournalMicroelectronics International
Volume12
Issue number2
DOIs
Publication statusPublished - 1995
MoE publication typeA1 Journal article-refereed

Cite this

Rusanen, Outi ; Lenkkeri, Jaakko ; Kivimäki, Liisa. / The effect of moisture on die attach joints made with silver filled epoxy. In: Microelectronics International. 1995 ; Vol. 12, No. 2. pp. 25-27.
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title = "The effect of moisture on die attach joints made with silver filled epoxy",
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year = "1995",
doi = "10.1108/eb044561",
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volume = "12",
pages = "25--27",
journal = "Microelectronics International",
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The effect of moisture on die attach joints made with silver filled epoxy. / Rusanen, Outi; Lenkkeri, Jaakko; Kivimäki, Liisa.

In: Microelectronics International, Vol. 12, No. 2, 1995, p. 25-27.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - The effect of moisture on die attach joints made with silver filled epoxy

AU - Rusanen, Outi

AU - Lenkkeri, Jaakko

AU - Kivimäki, Liisa

PY - 1995

Y1 - 1995

U2 - 10.1108/eb044561

DO - 10.1108/eb044561

M3 - Article

VL - 12

SP - 25

EP - 27

JO - Microelectronics International

JF - Microelectronics International

SN - 1356-5362

IS - 2

ER -