The effect of moisture on die attach joints made with silver filled epoxy adhesives

Outi Rusanen, Jaakko Lenkkeri, Liisa Kivimäki

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publication32nd ISHM-Nordic Conference
Subtitle of host publicationProceedings
Place of PublicationVedbæk
Pages230-236
Publication statusPublished - 1994
MoE publication typeA4 Article in a conference publication
Event32nd ISHM-Nordic Conference - Helsinki, Finland
Duration: 25 Sep 199428 Sep 1994

Conference

Conference32nd ISHM-Nordic Conference
CountryFinland
CityHelsinki
Period25/09/9428/09/94

Cite this

Rusanen, O., Lenkkeri, J., & Kivimäki, L. (1994). The effect of moisture on die attach joints made with silver filled epoxy adhesives. In 32nd ISHM-Nordic Conference: Proceedings (pp. 230-236).