The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

18 Citations (Scopus)

Abstract

We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components
Original languageEnglish
Title of host publicationSPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-0-8194-9903-5
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
EventSilicon Photonics IX - San Francisco, United States
Duration: 3 Feb 20145 Feb 2014

Publication series

SeriesProceedings of SPIE
Volume8990
ISSN0277-786X

Conference

ConferenceSilicon Photonics IX
CountryUnited States
CitySan Francisco
Period3/02/145/02/14

Fingerprint

platforms
Mach-Zehnder interferometers
optical waveguides
strip
resonators
waveguides
silicon

Keywords

  • semiconductors
  • waveguides
  • silicon photonics
  • high density integration
  • integrated optics
  • III-V integrated circuits

Cite this

Cherchi, M., Ylinen, S., Harjanne, M., Kapulainen, M., Vehmas, T., & Aalto, T. (2014). The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms. In SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials [899004] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8990 https://doi.org/10.1117/12.2039912
Cherchi, Matteo ; Ylinen, Sami ; Harjanne, Mikko ; Kapulainen, Markku ; Vehmas, Tapani ; Aalto, Timo. / The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms. SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE, 2014. (Proceedings of SPIE, Vol. 8990).
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abstract = "We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components",
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Cherchi, M, Ylinen, S, Harjanne, M, Kapulainen, M, Vehmas, T & Aalto, T 2014, The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms. in SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials., 899004, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8990, Silicon Photonics IX, San Francisco, United States, 3/02/14. https://doi.org/10.1117/12.2039912

The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms. / Cherchi, Matteo; Ylinen, Sami; Harjanne, Mikko; Kapulainen, Markku; Vehmas, Tapani; Aalto, Timo.

SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE, 2014. 899004 (Proceedings of SPIE, Vol. 8990).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Cherchi M, Ylinen S, Harjanne M, Kapulainen M, Vehmas T, Aalto T. The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms. In SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE. 2014. 899004. (Proceedings of SPIE, Vol. 8990). https://doi.org/10.1117/12.2039912