@inproceedings{329ba75c280542a39c365c1ab961d9cf,
title = "The Euler bend: Paving the way for high-density integration on micron-scale semiconductor platforms",
abstract = "We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components",
keywords = "semiconductors, waveguides, silicon photonics, high density integration, integrated optics, III-V integrated circuits",
author = "Matteo Cherchi and Sami Ylinen and Mikko Harjanne and Markku Kapulainen and Tapani Vehmas and Timo Aalto",
year = "2014",
doi = "10.1117/12.2039912",
language = "English",
isbn = "978-0-8194-9903-5",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Joel Kubby and Reed, {Graham T.}",
booktitle = "Silicon Photonics IX",
address = "United States",
note = "Silicon Photonics IX ; Conference date: 03-02-2014 Through 05-02-2014",
}