Ion beam techniques were used to study silicon‐on‐insulator (SOI) structures manufactured by the ion cutting process. Silicon wafers and epitaxial Si layers with various doping levels were implanted with H2+ ions at 100 keV prior to wafer bonding. Some wafers were also implanted with B+ ions at 175 keV. The implantation doses varied from 2.5 × 1016 to 5.0 × 1016 cm−2 for H2+ and from 1 × 1013 to 3 × 1015 cm−2 for B+. The thickness of an SOI layer was determined by conventional Rutherford backscattering spectrometry (RBS) and the crystal damage was examined by RBS in channelling mode (RBS/C). The disorder due to implanted hydrogen was found to decrease with increasing boron concentration. The measured thickness of the exfoliated Si layer was 455–460 nm for highly boron‐doped samples and 470–490 nm for the undoped samples. Exfoliation occurred inside the damage zone in all the samples, irrespective of hydrogen dose and boron doping. Our results suggest that the exfoliation depth in Si is associated with the lattice damage generated by the implantation.
- Rutherford backscattering
- ion cutting
Nurmela, A., Henttinen, K., Suni, T., & Suni, I. (2003). The influence of hydrogen dose and boron doping on the ion-cutting of Si. Surface and Interface Analysis, 35(9), 757-759. https://doi.org/10.1002/sia.1597