Abstract
The use of a disposable double spacer of
silicon-nitride/amorphous-silicon to fabricate lightly-doped-drain (LDD)
MOSFETs with just two masking steps compared to four in the
conventional oxide spacer LDD FET is discussed. The alpha -Si spacer is
disposed of after it has been used to pattern the nitride. The nitride
acts as a second spacer to block low-energy source/drain (S/D) implants
and to shift LDD implants away from the gate edge. Self-aligned
metallization can be realized using the nitride as silicidation
barrier.
| Original language | English |
|---|---|
| Pages (from-to) | 125 - 127 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 12 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 1991 |
| MoE publication type | A1 Journal article-refereed |