Thermal analysis of LTCC packaged MEMS atomic clock

R. Chutani, S. Galliou, N. Passilly, C. Gorecki, Aila Sitomaniemi, Mikko Heikkinen, Kari Kautio, Antti Keränen, A. Jornod

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock
Original languageEnglish
Title of host publicationProceedings of DTIP 2012
Subtitle of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages171-173
ISBN (Electronic)978-2-35500-021-8
ISBN (Print)978-1-4673-0785-7
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication
EventSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012 - Cannes, France
Duration: 25 Apr 201227 Apr 2012

Conference

ConferenceSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012
Abbreviated titleDTIP 2012
CountryFrance
CityCannes
Period25/04/1227/04/12

Fingerprint

Atomic clocks
Thermoanalysis
MEMS
Vapors
Temperature

Keywords

  • Atomic clock
  • LTCC package
  • MEMS
  • thermal analysis

Cite this

Chutani, R., Galliou, S., Passilly, N., Gorecki, C., Sitomaniemi, A., Heikkinen, M., ... Jornod, A. (2012). Thermal analysis of LTCC packaged MEMS atomic clock. In Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 171-173). Institute of Electrical and Electronic Engineers IEEE.
Chutani, R. ; Galliou, S. ; Passilly, N. ; Gorecki, C. ; Sitomaniemi, Aila ; Heikkinen, Mikko ; Kautio, Kari ; Keränen, Antti ; Jornod, A. / Thermal analysis of LTCC packaged MEMS atomic clock. Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronic Engineers IEEE, 2012. pp. 171-173
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title = "Thermal analysis of LTCC packaged MEMS atomic clock",
abstract = "This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock",
keywords = "Atomic clock, LTCC package, MEMS, thermal analysis",
author = "R. Chutani and S. Galliou and N. Passilly and C. Gorecki and Aila Sitomaniemi and Mikko Heikkinen and Kari Kautio and Antti Ker{\"a}nen and A. Jornod",
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Chutani, R, Galliou, S, Passilly, N, Gorecki, C, Sitomaniemi, A, Heikkinen, M, Kautio, K, Keränen, A & Jornod, A 2012, Thermal analysis of LTCC packaged MEMS atomic clock. in Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronic Engineers IEEE, pp. 171-173, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012, Cannes, France, 25/04/12.

Thermal analysis of LTCC packaged MEMS atomic clock. / Chutani, R.; Galliou, S.; Passilly, N.; Gorecki, C.; Sitomaniemi, Aila; Heikkinen, Mikko; Kautio, Kari; Keränen, Antti; Jornod, A.

Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronic Engineers IEEE, 2012. p. 171-173.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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T1 - Thermal analysis of LTCC packaged MEMS atomic clock

AU - Chutani, R.

AU - Galliou, S.

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AU - Gorecki, C.

AU - Sitomaniemi, Aila

AU - Heikkinen, Mikko

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KW - MEMS

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Chutani R, Galliou S, Passilly N, Gorecki C, Sitomaniemi A, Heikkinen M et al. Thermal analysis of LTCC packaged MEMS atomic clock. In Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronic Engineers IEEE. 2012. p. 171-173