Thermal analysis of LTCC packaged MEMS atomic clock

R. Chutani, S. Galliou, N. Passilly, C. Gorecki, Aila Sitomaniemi, Mikko Heikkinen, Kari Kautio, Antti Keränen, A. Jornod

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock
    Original languageEnglish
    Title of host publicationProceedings of DTIP 2012
    Subtitle of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages171-173
    ISBN (Electronic)978-2-35500-021-8
    ISBN (Print)978-1-4673-0785-7
    Publication statusPublished - 2012
    MoE publication typeA4 Article in a conference publication
    EventSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012 - Cannes, France
    Duration: 25 Apr 201227 Apr 2012

    Conference

    ConferenceSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012
    Abbreviated titleDTIP 2012
    CountryFrance
    CityCannes
    Period25/04/1227/04/12

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    Keywords

    • Atomic clock
    • LTCC package
    • MEMS
    • thermal analysis

    Cite this

    Chutani, R., Galliou, S., Passilly, N., Gorecki, C., Sitomaniemi, A., Heikkinen, M., Kautio, K., Keränen, A., & Jornod, A. (2012). Thermal analysis of LTCC packaged MEMS atomic clock. In Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 171-173). IEEE Institute of Electrical and Electronic Engineers .