Thermal analysis of LTCC packaged MEMS atomic clock

R. Chutani; S. Galliou; N. Passilly; C. Gorecki; Aila Sitomaniemi; Mikko Heikkinen; Kari Kautio; Antti Keränen; A. Jornod

Thermal analysis of LTCC packaged MEMS atomic clock

R. Chutani, S. Galliou, N. Passilly, C. Gorecki, Aila Sitomaniemi, Mikko Heikkinen, Kari Kautio, Antti Keränen, A. Jornod

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock

Original language	English
Title of host publication	Proceedings of DTIP 2012
Subtitle of host publication	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	171-173
ISBN (Electronic)	978-2-35500-021-8
ISBN (Print)	978-1-4673-0785-7
Publication status	Published - 2012
MoE publication type	A4 Article in a conference publication
Event	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012 - Cannes, France Duration: 25 Apr 2012 → 27 Apr 2012

Conference

Conference	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012
Abbreviated title	DTIP 2012
Country/Territory	France
City	Cannes
Period	25/04/12 → 27/04/12

Keywords

Atomic clock
LTCC package
MEMS
thermal analysis

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https://ieeexplore.ieee.org/document/6235313

Cite this

Chutani, R., Galliou, S., Passilly, N., Gorecki, C., Sitomaniemi, A., Heikkinen, M., Kautio, K., Keränen, A., & Jornod, A. (2012). Thermal analysis of LTCC packaged MEMS atomic clock. In Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 171-173). IEEE Institute of Electrical and Electronic Engineers. https://ieeexplore.ieee.org/document/6235313

@inproceedings{de40e33d434c43e69df6ae3e13ac58e0,

title = "Thermal analysis of LTCC packaged MEMS atomic clock",

abstract = "This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock",

keywords = "Atomic clock, LTCC package, MEMS, thermal analysis",

author = "R. Chutani and S. Galliou and N. Passilly and C. Gorecki and Aila Sitomaniemi and Mikko Heikkinen and Kari Kautio and Antti Ker{\"a}nen and A. Jornod",

year = "2012",

language = "English",

isbn = "978-1-4673-0785-7",

pages = "171--173",

booktitle = "Proceedings of DTIP 2012",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012, DTIP 2012 ; Conference date: 25-04-2012 Through 27-04-2012",

}

Chutani, R, Galliou, S, Passilly, N, Gorecki, C, Sitomaniemi, A, Heikkinen, M, Kautio, K, Keränen, A & Jornod, A 2012, Thermal analysis of LTCC packaged MEMS atomic clock. in Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. IEEE Institute of Electrical and Electronic Engineers, pp. 171-173, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012, Cannes, France, 25/04/12. <https://ieeexplore.ieee.org/document/6235313>

Thermal analysis of LTCC packaged MEMS atomic clock. / Chutani, R.; Galliou, S.; Passilly, N. et al.
Proceedings of DTIP 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. IEEE Institute of Electrical and Electronic Engineers, 2012. p. 171-173.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Thermal analysis of LTCC packaged MEMS atomic clock

AU - Chutani, R.

AU - Galliou, S.

AU - Passilly, N.

AU - Gorecki, C.

AU - Sitomaniemi, Aila

AU - Heikkinen, Mikko

AU - Kautio, Kari

AU - Keränen, Antti

AU - Jornod, A.

PY - 2012

Y1 - 2012

N2 - This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock

AB - This paper describes the thermal analysis of LTCC packaged Cs vapour cell for MEMS atomic clock. Aim is to maintain the temperature of the inner cell trapping the Cs vapour, which is a critical parameter for stable MEMS atomic clock

KW - Atomic clock

KW - LTCC package

KW - MEMS

KW - thermal analysis

M3 - Conference article in proceedings

SN - 978-1-4673-0785-7

SP - 171

EP - 173

BT - Proceedings of DTIP 2012

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012

Y2 - 25 April 2012 through 27 April 2012

ER -

Thermal analysis of LTCC packaged MEMS atomic clock

Abstract

Conference

Keywords

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