Thermal characterisation as a part of reliability testing of THz schottky diodes

Tero Kiuru, S. Khanal, J. Mallat, A. Räisänen, T. Närhi

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationXXXIII URSI Convention on Radio Science
Place of PublicationHelsinki
PublisherAalto University
Pages121-123
ISBN (Print)978-952-60-5142-0
Publication statusPublished - 2013
MoE publication typeNot Eligible
EventXXXIII URSI Convention on Radio Science - Espoo, Finland
Duration: 24 Apr 201325 Apr 2013

Conference

ConferenceXXXIII URSI Convention on Radio Science
CountryFinland
CityEspoo
Period24/04/1325/04/13

Fingerprint

Diodes
Testing
Semiconductor diodes
Satellites
Heating
Hot Temperature

Cite this

Kiuru, T., Khanal, S., Mallat, J., Räisänen, A., & Närhi, T. (2013). Thermal characterisation as a part of reliability testing of THz schottky diodes. In Proceedings: XXXIII URSI Convention on Radio Science (pp. 121-123). Helsinki: Aalto University.
Kiuru, Tero ; Khanal, S. ; Mallat, J. ; Räisänen, A. ; Närhi, T. / Thermal characterisation as a part of reliability testing of THz schottky diodes. Proceedings: XXXIII URSI Convention on Radio Science. Helsinki : Aalto University, 2013. pp. 121-123
@inproceedings{daa7868382d74ee9a808902d74e6b0de,
title = "Thermal characterisation as a part of reliability testing of THz schottky diodes",
abstract = "This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed",
author = "Tero Kiuru and S. Khanal and J. Mallat and A. R{\"a}is{\"a}nen and T. N{\"a}rhi",
note = "Project code: 78177",
year = "2013",
language = "English",
isbn = "978-952-60-5142-0",
pages = "121--123",
booktitle = "Proceedings",
publisher = "Aalto University",
address = "Finland",

}

Kiuru, T, Khanal, S, Mallat, J, Räisänen, A & Närhi, T 2013, Thermal characterisation as a part of reliability testing of THz schottky diodes. in Proceedings: XXXIII URSI Convention on Radio Science. Aalto University, Helsinki, pp. 121-123, XXXIII URSI Convention on Radio Science, Espoo, Finland, 24/04/13.

Thermal characterisation as a part of reliability testing of THz schottky diodes. / Kiuru, Tero; Khanal, S.; Mallat, J.; Räisänen, A.; Närhi, T.

Proceedings: XXXIII URSI Convention on Radio Science. Helsinki : Aalto University, 2013. p. 121-123.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Thermal characterisation as a part of reliability testing of THz schottky diodes

AU - Kiuru, Tero

AU - Khanal, S.

AU - Mallat, J.

AU - Räisänen, A.

AU - Närhi, T.

N1 - Project code: 78177

PY - 2013

Y1 - 2013

N2 - This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed

AB - This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed

M3 - Conference article in proceedings

SN - 978-952-60-5142-0

SP - 121

EP - 123

BT - Proceedings

PB - Aalto University

CY - Helsinki

ER -

Kiuru T, Khanal S, Mallat J, Räisänen A, Närhi T. Thermal characterisation as a part of reliability testing of THz schottky diodes. In Proceedings: XXXIII URSI Convention on Radio Science. Helsinki: Aalto University. 2013. p. 121-123