Thermal characterisation as a part of reliability testing of THz schottky diodes

Tero Kiuru, Subash Khanal, Juha Mallat, Antti V. Räisänen, Tapani Närhi

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review


    This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed
    Original languageEnglish
    Title of host publicationXXXIII URSI Convention on Radio Science and SMARAD Seminar 2013
    EditorsAri H. Sihvola, Henrik Wallén
    Place of PublicationEspoo
    PublisherAalto University
    ISBN (Print)978-952-60-5142-0
    Publication statusPublished - 2013
    MoE publication typeNot Eligible
    EventXXXIII URSI Convention on Radio Science - Espoo, Finland
    Duration: 24 Apr 201325 Apr 2013

    Publication series

    SeriesAalto University Publication Series Science + Technology


    ConferenceXXXIII URSI Convention on Radio Science


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