Thermal characterisation as a part of reliability testing of THz schottky diodes

Tero Kiuru, S. Khanal, J. Mallat, A. Räisänen, T. Närhi

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publicationXXXIII URSI Convention on Radio Science
    Place of PublicationHelsinki
    PublisherAalto University
    Pages121-123
    ISBN (Print)978-952-60-5142-0
    Publication statusPublished - 2013
    MoE publication typeNot Eligible
    EventXXXIII URSI Convention on Radio Science - Espoo, Finland
    Duration: 24 Apr 201325 Apr 2013

    Conference

    ConferenceXXXIII URSI Convention on Radio Science
    CountryFinland
    CityEspoo
    Period24/04/1325/04/13

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  • Cite this

    Kiuru, T., Khanal, S., Mallat, J., Räisänen, A., & Närhi, T. (2013). Thermal characterisation as a part of reliability testing of THz schottky diodes. In Proceedings: XXXIII URSI Convention on Radio Science (pp. 121-123). Aalto University. http://www.ursi.fi/2013/data/uploads/b3-1.pdf