Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | XXXIII URSI Convention on Radio Science |
| Place of Publication | Helsinki |
| Publisher | Aalto University |
| Pages | 121-123 |
| ISBN (Print) | 978-952-60-5142-0 |
| Publication status | Published - 2013 |
| MoE publication type | Not Eligible |
| Event | XXXIII URSI Convention on Radio Science - Espoo, Finland Duration: 24 Apr 2013 → 25 Apr 2013 |
Conference
| Conference | XXXIII URSI Convention on Radio Science |
|---|---|
| Country | Finland |
| City | Espoo |
| Period | 24/04/13 → 25/04/13 |
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Thermal characterisation as a part of reliability testing of THz schottky diodes. / Kiuru, Tero; Khanal, S.; Mallat, J.; Räisänen, A.; Närhi, T.
Proceedings: XXXIII URSI Convention on Radio Science. Helsinki : Aalto University, 2013. p. 121-123.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Thermal characterisation as a part of reliability testing of THz schottky diodes
AU - Kiuru, Tero
AU - Khanal, S.
AU - Mallat, J.
AU - Räisänen, A.
AU - Närhi, T.
N1 - Project code: 78177
PY - 2013
Y1 - 2013
N2 - This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed
AB - This paper presents the most common thermal characterisation methods for semiconductor diodes and discusses why thermal characterisation is important for the diode reliability assessment. A special case of thermal characterisation of THz frequency Schottky diodes for MetOp Second Generation (MetOp-SG) satellite program instruments is covered in more detail. The benefits of accurate thermal characterisation in this case are explained and the drawbacks of unknown self-heating are discussed
M3 - Conference article in proceedings
SN - 978-952-60-5142-0
SP - 121
EP - 123
BT - Proceedings
PB - Aalto University
CY - Helsinki
ER -