Thermal characterization of thermal interface materials using the three-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.
Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference (ESTC)
PublisherInstitute of Electrical and Electronic Engineers IEEE
ISBN (Electronic)978-1-5386-6814-6, 978-1-5386-6813-9
ISBN (Print)978-1-5386-6815-3
DOIs
Publication statusPublished - 2018
MoE publication typeNot Eligible
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany
Duration: 18 Sep 201821 Sep 2018
Conference number: 7

Conference

Conference7th Electronic System-Integration Technology Conference, ESTC 2018
Abbreviated titleESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Fingerprint

thermal conductivity
fillers

Keywords

  • 3-omega method
  • epoxy
  • thermal conductivity
  • thermal diffusivity
  • thermal interface materials

Cite this

Grosse, C., Ras, M. A., Varpula, A., Grigoras, K., May, D., Prunnila, M., & Wunderle, B. (2018). Thermal characterization of thermal interface materials using the three-omega method. In 2018 7th Electronic System-Integration Technology Conference (ESTC) [8546370] Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ESTC.2018.8546370
Grosse, Corinna ; Ras, Mohamad Abo ; Varpula, Aapo ; Grigoras, Kestutis ; May, Daniel ; Prunnila, Mika ; Wunderle, Bernhard. / Thermal characterization of thermal interface materials using the three-omega method. 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE, 2018.
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abstract = "The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.",
keywords = "3-omega method, epoxy, thermal conductivity, thermal diffusivity, thermal interface materials",
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Grosse, C, Ras, MA, Varpula, A, Grigoras, K, May, D, Prunnila, M & Wunderle, B 2018, Thermal characterization of thermal interface materials using the three-omega method. in 2018 7th Electronic System-Integration Technology Conference (ESTC)., 8546370, Institute of Electrical and Electronic Engineers IEEE, 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546370

Thermal characterization of thermal interface materials using the three-omega method. / Grosse, Corinna; Ras, Mohamad Abo; Varpula, Aapo; Grigoras, Kestutis; May, Daniel; Prunnila, Mika; Wunderle, Bernhard.

2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE, 2018. 8546370.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Prunnila, Mika

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AB - The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.

KW - 3-omega method

KW - epoxy

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Grosse C, Ras MA, Varpula A, Grigoras K, May D, Prunnila M et al. Thermal characterization of thermal interface materials using the three-omega method. In 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronic Engineers IEEE. 2018. 8546370 https://doi.org/10.1109/ESTC.2018.8546370