Thermal characterization of thermal interface materials using the three-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.
Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference (ESTC)
PublisherIEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)978-1-5386-6814-6, 978-1-5386-6813-9
ISBN (Print)978-1-5386-6815-3
DOIs
Publication statusPublished - 2018
MoE publication typeNot Eligible
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany
Duration: 18 Sep 201821 Sep 2018
Conference number: 7

Conference

Conference7th Electronic System-Integration Technology Conference, ESTC 2018
Abbreviated titleESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Keywords

  • 3-omega method
  • epoxy
  • thermal conductivity
  • thermal diffusivity
  • thermal interface materials
  • OtaNano

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