Abstract
The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.
| Original language | English |
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| Title of host publication | 2018 7th Electronic System-Integration Technology Conference (ESTC) |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| ISBN (Electronic) | 978-1-5386-6814-6, 978-1-5386-6813-9 |
| ISBN (Print) | 978-1-5386-6815-3 |
| DOIs | |
| Publication status | Published - 2018 |
| MoE publication type | A4 Article in a conference publication |
| Event | 7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany Duration: 18 Sept 2018 → 21 Sept 2018 Conference number: 7 |
Conference
| Conference | 7th Electronic System-Integration Technology Conference, ESTC 2018 |
|---|---|
| Abbreviated title | ESTC 2018 |
| Country/Territory | Germany |
| City | Dresden |
| Period | 18/09/18 → 21/09/18 |
Funding
Keywords
- 3-omega method
- epoxy
- thermal conductivity
- thermal diffusivity
- thermal interface materials
- OtaNano