Thermal characterization of thermal interface materials using the three-omega method

Corinna Grosse; Mohamad Abo Ras; Aapo Varpula; Kestutis Grigoras; Daniel May; Mika Prunnila; Bernhard Wunderle

doi:10.1109/ESTC.2018.8546370

Thermal characterization of thermal interface materials using the three-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle

QTF - Quantum Technology Finland - The National Centre of Excellence

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.

Original language	English
Title of host publication	2018 7th Electronic System-Integration Technology Conference (ESTC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)	978-1-5386-6814-6, 978-1-5386-6813-9
ISBN (Print)	978-1-5386-6815-3
DOIs	https://doi.org/10.1109/ESTC.2018.8546370
Publication status	Published - 2018
MoE publication type	A4 Article in a conference publication
Event	7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany Duration: 18 Sept 2018 → 21 Sept 2018 Conference number: 7

Conference

Conference	7th Electronic System-Integration Technology Conference, ESTC 2018
Abbreviated title	ESTC 2018
Country/Territory	Germany
City	Dresden
Period	18/09/18 → 21/09/18

Keywords

3-omega method
epoxy
thermal conductivity
thermal diffusivity
thermal interface materials
OtaNano

Access to Document

10.1109/ESTC.2018.8546370

Cite this

@inproceedings{a41efaf67ad14c9c9b0cac4a46d52a3c,

title = "Thermal characterization of thermal interface materials using the three-omega method",

abstract = "The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.",

keywords = "3-omega method, epoxy, thermal conductivity, thermal diffusivity, thermal interface materials, OtaNano",

author = "Corinna Grosse and Ras, \{Mohamad Abo\} and Aapo Varpula and Kestutis Grigoras and Daniel May and Mika Prunnila and Bernhard Wunderle",

year = "2018",

doi = "10.1109/ESTC.2018.8546370",

language = "English",

isbn = "978-1-5386-6815-3",

booktitle = "2018 7th Electronic System-Integration Technology Conference (ESTC)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "7th Electronic System-Integration Technology Conference, ESTC 2018, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",

}

Grosse, C, Ras, MA, Varpula, A , Grigoras, K, May, D, Prunnila, M & Wunderle, B 2018, Thermal characterization of thermal interface materials using the three-omega method. in 2018 7th Electronic System-Integration Technology Conference (ESTC)., 8546370, IEEE Institute of Electrical and Electronic Engineers, 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Saxony, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546370

Thermal characterization of thermal interface materials using the three-omega method. / Grosse, Corinna; Ras, Mohamad Abo; Varpula, Aapo et al.
2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers, 2018. 8546370.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Thermal characterization of thermal interface materials using the three-omega method

AU - Grosse, Corinna

AU - Ras, Mohamad Abo

AU - Varpula, Aapo

AU - Grigoras, Kestutis

AU - May, Daniel

AU - Prunnila, Mika

AU - Wunderle, Bernhard

N1 - Conference code: 7

PY - 2018

Y1 - 2018

N2 - The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.

AB - The thermal conductivity of different thermal interface materials was investigated using an extension of the 3-omega method. The results are compared to results of a conventional steady-state thermal characterization method. The thermal conductivity of a gap filler pad has been measured under pressure. The measurements using the 3-omega system are faster than the steady-state method with a similar accuracy.

KW - 3-omega method

KW - epoxy

KW - thermal conductivity

KW - thermal diffusivity

KW - thermal interface materials

KW - OtaNano

UR - https://www.scopus.com/pages/publications/85060044338

U2 - 10.1109/ESTC.2018.8546370

DO - 10.1109/ESTC.2018.8546370

M3 - Conference article in proceedings

SN - 978-1-5386-6815-3

BT - 2018 7th Electronic System-Integration Technology Conference (ESTC)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 7th Electronic System-Integration Technology Conference, ESTC 2018

Y2 - 18 September 2018 through 21 September 2018

ER -

Thermal characterization of thermal interface materials using the three-omega method

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Keywords

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Thermal characterization of thermal interface materials using the three-omega method

Abstract

Conference

Keywords

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OtaNano

Cite this