Abstract
This paper presents a new method for thermal
characterization of THz Schottky diodes. The method is
based on the transient current behavior, and it enables
the extraction of thermal resistances, thermal
time-constants, and peak junction temperatures of THz
Schottky diodes. Many typical challenges in thermal
characterization of small-area diode devices,
particularly those related to self-heating and electrical
transients, are either avoided or mitigated. The method
is validated with measurements of commercially available
single-anode Schottky varactor diodes. A verification
routine is performed to ensure the accuracy of the
measurement setup, and the characterization results are
compared against an in-house measurement-based method and
against simulation results of two commercial 3-D thermal
simulators. For example, characterization result for the
total thermal resistance of a Schottky diode with an
anode area of 9 µm2 is within 10% of the average value of
4020 K/W when using all four approaches. The new method
can be used to measure small diode devices with thermal
time constants down to about 300 ns with the measurement
setup described in the paper
Original language | English |
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Pages (from-to) | 267-276 |
Number of pages | 9 |
Journal | IEEE Transactions on Terahertz Science and Technology |
Volume | 4 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2014 |
MoE publication type | A1 Journal article-refereed |
Keywords
- Junction temperature
- Schottky diode
- thermal impedance
- thermal parameters
- thermal resistance
- thermal time constant
- transient measurement