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Thermal effects of replacing solder with conductive adhesives
Outi Spalding
VTT Technical Research Centre of Finland
VTT (former employee or external)
Research output
:
Contribution to journal
›
Article
›
Scientific
›
peer-review
1
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Dive into the research topics of 'Thermal effects of replacing solder with conductive adhesives'. Together they form a unique fingerprint.
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Keyphrases
Thermal Resistance
100%
Thermal Effect
100%
Soldering
100%
Conductive Adhesive
100%
Epoxy Adhesive
50%
Heat Conductivity
50%
Die-bonding
50%
Filled Epoxy
50%
Adhesion
25%
Aluminum Oxide
25%
Good Quality
25%
Heat Flow
25%
Thermal Simulation
25%
Uniform Layer
25%
Adhesive Joints
25%
Alumina Substrate
25%
Copper Plate
25%
Ag-Pt
25%
Soft Solder
25%
Silicone Adhesive
25%
Adhesive Layer Thickness
25%
Tin-lead Solder
25%
V-die
25%
Thick Film Conductor
25%
Power Diode
25%
Solder Layer
25%
INIS
adhesives
100%
thermal effects
100%
layers
44%
thickness
33%
dies
33%
simulation
22%
aluminium oxides
22%
heat
22%
epoxides
22%
comparative evaluations
11%
surfaces
11%
substrates
11%
power
11%
adhesion
11%
thin films
11%
films
11%
silver
11%
copper
11%
plates
11%
tin
11%
heat flow
11%
silicones
11%
Engineering
Conductive Adhesive
100%
Heat Resistance
100%
Thermal Effect
100%
Aluminum Oxide
50%
Layer Thickness
25%
Thin Layer
25%
Adhesive Joints
25%
Adhesive Layer
25%
Epoxy Adhesive
25%
Copper Plate
25%
Thermal Simulation
25%
Material Science
Heat Resistance
100%
Thermal Conductivity
50%
Aluminum Oxide
50%
Conductor
25%
Polysiloxane
25%
Tin
25%
Thick Films
25%